Seiichi Kurihara

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Chikusei-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Multilayer wiring plate and method for fabricating same
- Patent number 10,027,012
- Issue date Jul 17, 2018
- Hitachi Chemical Company, Ltd.
- Hiroyuki Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulated coated wire having a wire coating layer of a resin surrou...
- Patent number 9,966,164
- Issue date May 8, 2018
- Hitachi Chemical Company, Ltd.
- Hiroyuki Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring board with metal foil wiring layer, wire wiring l...
- Patent number 9,668,345
- Issue date May 30, 2017
- Hitachi Chemical Company, Ltd.
- Hiroyuki Yamaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INSULATED COVERED WIRE AND MULTI-WIRE WIRING BOARD
- Publication number 20160104928
- Publication date Apr 14, 2016
- Hitachi Chemical Company, Ltd.
- Hiroyuki YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER WIRING PLATE AND METHOD FOR FABRICATING SAME
- Publication number 20150357699
- Publication date Dec 10, 2015
- Hitachi Chemical Company, Ltd.
- Hiroyuki YAMAGUCHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING BOARD
- Publication number 20150075843
- Publication date Mar 19, 2015
- Hitachi Chemical Company, Ltd.
- Hiroyuki Yamaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR