Seiichi Nakatani

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Conductive paste for forming conductive film for semiconductor devi...
- Patent number 10,030,156
- Issue date Jul 24, 2018
- KYOTO ELEX CO., LTD.
- Kazuya Takagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component package and method for manufacturing the same
- Patent number 9,825,209
- Issue date Nov 21, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kazuma Mima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device and method for manufacturing the same
- Patent number 9,627,583
- Issue date Apr 18, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Susumu Sawada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component package and method for manufacturing same
- Patent number 9,595,651
- Issue date Mar 14, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yoshihisa Yamashita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrochemical detector and method for producing same
- Patent number 9,541,518
- Issue date Jan 10, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yoshihisa Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 9,449,937
- Issue date Sep 20, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Koji Kawakita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component package and method for manufacturing same
- Patent number 9,449,944
- Issue date Sep 20, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Susumu Sawada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component package and method for manufacturing the same
- Patent number 9,425,122
- Issue date Aug 23, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Koji Kawakita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component assembly
- Patent number 9,426,899
- Issue date Aug 23, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takashi Kitae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component package and method of manufacturing same
- Patent number 9,368,469
- Issue date Jun 14, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Seiichi Nakatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transparent electrode and method for manufacturing the same
- Patent number 9,330,811
- Issue date May 3, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takashi Ichiryu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Ceramic substrate composite and method for manufacturing ceramic su...
- Patent number 9,320,155
- Issue date Apr 19, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Taiji Kuroiwa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Built-up substrate, method for manufacturing same, and semiconducto...
- Patent number 9,236,338
- Issue date Jan 12, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Seiichi Nakatani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid substrate, method for manufacturing the same, and semiconduc...
- Patent number 9,107,306
- Issue date Aug 11, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Seiichi Nakatani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for mounting light-emitting element and light-emitting de...
- Patent number 9,076,714
- Issue date Jul 7, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Seiichi Nakatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible semiconductor device
- Patent number 8,975,626
- Issue date Mar 10, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takeshi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing flexible semiconductor device having gate...
- Patent number 8,895,373
- Issue date Nov 25, 2014
- Panasonic Corporation
- Takeshi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode structure and method for forming bump
- Patent number 8,887,383
- Issue date Nov 18, 2014
- Panasonic Corporation
- Yasushi Taniguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip-chip mounting resin composition and bump forming resin composi...
- Patent number 8,709,293
- Issue date Apr 29, 2014
- Panasonic Corporation
- Takashi Kitae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip-chip mounting method and bump formation method
- Patent number 8,691,683
- Issue date Apr 8, 2014
- Panasonic Corporation
- Koichi Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making a semiconductor device on a flexible substrate
- Patent number 8,617,943
- Issue date Dec 31, 2013
- Panasonic Corporation
- Takashi Ichiryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic paper and method for producing same
- Patent number 8,593,720
- Issue date Nov 26, 2013
- Panasonic Corporation
- Koichi Hirano
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Flexible semiconductor device having gate electrode disposed within...
- Patent number 8,581,247
- Issue date Nov 12, 2013
- Panasonic Corporation
- Takeshi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible semiconductor device and method for producing the same
- Patent number 8,525,178
- Issue date Sep 3, 2013
- Panasonic Corporation
- Takashi Ichiryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible semiconductor device
- Patent number 8,525,172
- Issue date Sep 3, 2013
- Panasonic Corporation
- Koichi Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for connecting between substrates, flip-chip mounting struct...
- Patent number 8,501,583
- Issue date Aug 6, 2013
- Panasonic Corporation
- Takashi Kitae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing flexible semiconductor device
- Patent number 8,435,842
- Issue date May 7, 2013
- Panasonic Corporation
- Koichi Hirano
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Manufacturing method of flexible semiconductor device
- Patent number 8,367,488
- Issue date Feb 5, 2013
- Panasonic Corporation
- Takashi Ichiryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible semiconductor device and method for manufacturing same
- Patent number 8,343,822
- Issue date Jan 1, 2013
- Panasonic Corporation
- Koichi Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip, semiconductor mounting module, mobile communica...
- Patent number 8,324,623
- Issue date Dec 4, 2012
- Panasonic Corporation
- Koichi Hirano
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LIGHT EMITTING DEVICE, METHOD FOR MANUFACTURING SAME, AND BODY HAVI...
- Publication number 20150280093
- Publication date Oct 1, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO, LTD
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PACKAGE AND METHOD FOR MANUFACTURING SAME
- Publication number 20150236233
- Publication date Aug 20, 2015
- Panasonic Intellectual Property Management Co., Ltd.
- Yoshihisa Yamashita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTRONIC COMPONENT PACKAGE AND METHOD FOR MANUFACTURING SAME
- Publication number 20150228619
- Publication date Aug 13, 2015
- Panasonic Intellectual Property Management Co., Ltd.
- Susumu Sawada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PACKAGE AND METHOD FOR PRODUCING SAME
- Publication number 20150221842
- Publication date Aug 6, 2015
- Panasonic Intellectual Property Management Co., Lt
- Kazuma Mima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150214129
- Publication date Jul 30, 2015
- Panasonic Intellectual Property Management Co., Ltd.
- Koji Kawakita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150206819
- Publication date Jul 23, 2015
- Panasonic Intellectual Property Management Co., Ltd.
- Takashi Ichiryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Paste for Forming Conductive Film for Semiconductor Devi...
- Publication number 20150159025
- Publication date Jun 11, 2015
- KYOTO ELEX CO., LTD.
- Kazuya Takagi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME
- Publication number 20150155251
- Publication date Jun 4, 2015
- Panasonic Intellectual Property Management Co., Ltd.
- Koji Kawakita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING APPARATUS AND METHOD FOR MANUFACTURING SAME
- Publication number 20150084080
- Publication date Mar 26, 2015
- PANASONIC CORPORATION
- Koji Kawakita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20150076545
- Publication date Mar 19, 2015
- Panasonic Intellectual Property Management Co., Lt
- Seiichi Nakatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150008467
- Publication date Jan 8, 2015
- Susumu Sawada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSPARENT ELECTRODE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140151085
- Publication date Jun 5, 2014
- PANASONIC CORPORATION
- Takashi Ichiryu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTROCHEMICAL DETECTOR AND METHOD FOR PRODUCING SAME
- Publication number 20140151225
- Publication date Jun 5, 2014
- PANASONIC CORPORATION
- Yoshihisa Yamashita
- G01 - MEASURING TESTING
Information Patent Application
CERAMIC SUBSTRATE COMPOSITE AND METHOD FOR MANUFACTURING CERAMIC SU...
- Publication number 20140131076
- Publication date May 15, 2014
- PANASONIC CORPORATION
- Taiji Kuroiwa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BUILT-UP SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTO...
- Publication number 20140124777
- Publication date May 8, 2014
- PANASONIC CORPORATION
- Seiichi Nakatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING FLEXIBLE SEMICONDUCTOR DEVICE HAVING GATE...
- Publication number 20140038366
- Publication date Feb 6, 2014
- PANASONIC CORPORATION
- Takeshi SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID SUBSTRATE, PRODUCTION METHOD THEREFOR, AND SEMICONDUCTOR INT...
- Publication number 20130200516
- Publication date Aug 8, 2013
- Seiichi Nakatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20130168677
- Publication date Jul 4, 2013
- PANASONIC CORPORATION
- Koichi HIRANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR LIGHT-EMITTING ELEMENT, METHOD FOR MANUFACTURING THE...
- Publication number 20120319159
- Publication date Dec 20, 2012
- Seiichi Nakatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME AN...
- Publication number 20120286264
- Publication date Nov 15, 2012
- Takeshi Suzuki
- G02 - OPTICS
Information Patent Application
FLEXIBLE SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME
- Publication number 20120181543
- Publication date Jul 19, 2012
- Takashi Ichiryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PAPER AND METHOD FOR PRODUCING SAME
- Publication number 20120113500
- Publication date May 10, 2012
- Koichi Hirano
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
FLEXIBLE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20120001173
- Publication date Jan 5, 2012
- Takeshi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID SUBSTRATE AND METHOD FOR PRODUCING THE SAME
- Publication number 20110293874
- Publication date Dec 1, 2011
- Takashi TOYOOKA
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME AND IMAGE D...
- Publication number 20110204366
- Publication date Aug 25, 2011
- PANASONIC CORPORATION
- Seiichi Nakatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME AND IMAGE D...
- Publication number 20110204367
- Publication date Aug 25, 2011
- PANASONIC CORPORATION
- Seiichi Nakatani
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
FLIP CHIP MOUNTING METHOD AND BUMP FORMING METHOD
- Publication number 20110201195
- Publication date Aug 18, 2011
- PANASONIC CORPORATION
- Takashi KITAE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR CHIP, SEMICONDUCTOR MOUNTING MODULE, MOBILE COMMUNICA...
- Publication number 20110180900
- Publication date Jul 28, 2011
- PANASONIC CORPORATION
- Koichi HIRANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP MOUNTING METHOD AND BUMP FORMATION METHOD
- Publication number 20110162578
- Publication date Jul 7, 2011
- PANASONIC CORPORATION
- Koichi Hirano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF FLEXIBLE SEMICONDUCTOR DEVICE
- Publication number 20110121298
- Publication date May 26, 2011
- Takashi Ichiryu
- H01 - BASIC ELECTRIC ELEMENTS

Seiichi Nakatani

Person

Patents Grantslast 30 patents

Conductive paste for forming conductive film for semiconductor devi...

Electronic component package and method for manufacturing the same

Light-emitting device and method for manufacturing the same

Electronic component package and method for manufacturing same

Electrochemical detector and method for producing same

Semiconductor device and method for manufacturing the same

Electronic component package and method for manufacturing same

Electronic component package and method for manufacturing the same

Electronic component assembly

Electronic component package and method of manufacturing same

Transparent electrode and method for manufacturing the same

Ceramic substrate composite and method for manufacturing ceramic su...

Built-up substrate, method for manufacturing same, and semiconducto...

Hybrid substrate, method for manufacturing the same, and semiconduc...

Substrate for mounting light-emitting element and light-emitting de...

Flexible semiconductor device

Method for manufacturing flexible semiconductor device having gate...

Electrode structure and method for forming bump

Flip-chip mounting resin composition and bump forming resin composi...

Flip-chip mounting method and bump formation method

Method for making a semiconductor device on a flexible substrate

Electronic paper and method for producing same

Flexible semiconductor device having gate electrode disposed within...

Flexible semiconductor device and method for producing the same

Flexible semiconductor device

Method for connecting between substrates, flip-chip mounting struct...

Method for manufacturing flexible semiconductor device

Manufacturing method of flexible semiconductor device

Flexible semiconductor device and method for manufacturing same

Semiconductor chip, semiconductor mounting module, mobile communica...

Patents Applicationslast 30 patents

LIGHT EMITTING DEVICE, METHOD FOR MANUFACTURING SAME, AND BODY HAVI...

ELECTRONIC COMPONENT PACKAGE AND METHOD FOR MANUFACTURING SAME

ELECTRONIC COMPONENT PACKAGE AND METHOD FOR MANUFACTURING SAME

ELECTRONIC COMPONENT PACKAGE AND METHOD FOR PRODUCING SAME

ELECTRONIC COMPONENT PACKAGE AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC COMPONENT PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Conductive Paste for Forming Conductive Film for Semiconductor Devi...

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME

LIGHT EMITTING APPARATUS AND METHOD FOR MANUFACTURING SAME

ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING SAME

LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME

TRANSPARENT ELECTRODE AND METHOD FOR MANUFACTURING THE SAME

ELECTROCHEMICAL DETECTOR AND METHOD FOR PRODUCING SAME

CERAMIC SUBSTRATE COMPOSITE AND METHOD FOR MANUFACTURING CERAMIC SU...

BUILT-UP SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTO...

METHOD FOR MANUFACTURING FLEXIBLE SEMICONDUCTOR DEVICE HAVING GATE...

HYBRID SUBSTRATE, PRODUCTION METHOD THEREFOR, AND SEMICONDUCTOR INT...

FLEXIBLE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

SUBSTRATE FOR LIGHT-EMITTING ELEMENT, METHOD FOR MANUFACTURING THE...

FLEXIBLE SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME AN...

FLEXIBLE SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME

ELECTRONIC PAPER AND METHOD FOR PRODUCING SAME

FLEXIBLE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

HYBRID SUBSTRATE AND METHOD FOR PRODUCING THE SAME

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME AND IMAGE D...

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME AND IMAGE D...

FLIP CHIP MOUNTING METHOD AND BUMP FORMING METHOD

SEMICONDUCTOR CHIP, SEMICONDUCTOR MOUNTING MODULE, MOBILE COMMUNICA...

FLIP-CHIP MOUNTING METHOD AND BUMP FORMATION METHOD

MANUFACTURING METHOD OF FLEXIBLE SEMICONDUCTOR DEVICE