Seiichi Orimo

Person

Kawasaki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Device having resin package and method of producing the same
- Patent number 7,144,754
- Issue date Dec 5, 2006
- Fujitsu Limited
- Yoshiyuki Yoneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device having resin package and method of producing the same
- Patent number 6,856,017
- Issue date Feb 15, 2005
- Fujitsu Limited
- Yoshiyuki Yoneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for a vertically accumulable semiconductor device with ex...
- Patent number 6,433,418
- Issue date Aug 13, 2002
- Fujitsu Limited
- Tetsuya Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mount type semiconductor device and method of producing the...
- Patent number 6,333,564
- Issue date Dec 25, 2001
- Fujitsu Limited
- Yoshitsugu Katoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of producing the same
- Patent number 6,288,444
- Issue date Sep 11, 2001
- Fujitsu Limited
- Mitsuo Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a lead portion with outer connecting te...
- Patent number 6,255,740
- Issue date Jul 3, 2001
- Fujitsu Limited
- Kazuto Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for fabricating semiconductor device
- Patent number 6,159,770
- Issue date Dec 12, 2000
- Fujitsu Limited
- Masafumi Tetaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device module
- Patent number 6,094,356
- Issue date Jul 25, 2000
- Fujitsu Limited
- Tetsuya Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device having resin package with projections
- Patent number 6,072,239
- Issue date Jun 6, 2000
- Fujitsu Limited
- Yoshiyuki Yoneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a frame terminal
- Patent number 6,025,650
- Issue date Feb 15, 2000
- Fujitsu Limited
- Kazuto Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a semiconductor device
- Patent number 5,930,603
- Issue date Jul 27, 1999
- Fujitsu Limited
- Kazuto Tsuji
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of producing a semicondutor device having a lead portion wit...
- Patent number 5,656,550
- Issue date Aug 12, 1997
- Fujitsu Limited
- Kazuto Tsuji
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Device having resin package and method of producing the same
- Publication number 20040219719
- Publication date Nov 4, 2004
- FUJITSU LIMITED
- Yoshiyuki Yoneda
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
DEVICE HAVING RESIN PACKAGE AND METHOD OF PRODUCING THE SAME
- Publication number 20030006503
- Publication date Jan 9, 2003
- YOSHIYUKI YONEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of producing the same
- Publication number 20010052653
- Publication date Dec 20, 2001
- Mitsuo Abe
- H01 - BASIC ELECTRIC ELEMENTS

Seiichi Orimo

Person

Patents Grantslast 30 patents

Device having resin package and method of producing the same

Device having resin package and method of producing the same

Apparatus for a vertically accumulable semiconductor device with ex...

Surface mount type semiconductor device and method of producing the...

Semiconductor device and method of producing the same

Semiconductor device having a lead portion with outer connecting te...

Method and apparatus for fabricating semiconductor device

Semiconductor device and semiconductor device module

Device having resin package with projections

Semiconductor device including a frame terminal

Method for producing a semiconductor device

Method of producing a semicondutor device having a lead portion wit...

Patents Applicationslast 30 patents

Device having resin package and method of producing the same

DEVICE HAVING RESIN PACKAGE AND METHOD OF PRODUCING THE SAME

Semiconductor device and method of producing the same