Seiichi Sai

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wafer for examination and examination method of energy distribution
- Patent number 10,994,368
- Issue date May 4, 2021
- Disco Corporation
- Seiichi Sai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Condensing point position detecting method
- Patent number 10,183,359
- Issue date Jan 22, 2019
- Disco Corporation
- Joel Koerwer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WAFER FOR EXAMINATION AND EXAMINATION METHOD OF ENERGY DISTRIBUTION
- Publication number 20190061050
- Publication date Feb 28, 2019
- Disco Corporation
- Seiichi Sai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDENSING POINT POSITION DETECTING METHOD
- Publication number 20180299786
- Publication date Oct 18, 2018
- Disco Corporation
- Joel Koerwer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR