Seiichi Saito

Person

Chiba, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Optical fiber
- Patent number 9,297,950
- Issue date Mar 29, 2016
- Sumitomo Electric Industries, Ltd.
- Kazuyuki Sohma
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Semiconductor device and signal processing method thereof
- Patent number 9,231,717
- Issue date Jan 5, 2016
- Renesas Electronics Corporation
- Yoshihiko Hotta
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Photocurable resin composition and novel siloxane compound
- Patent number 9,063,415
- Issue date Jun 23, 2015
- Adeka Corporation
- Kenji Hara
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Semiconductor device and signal processing method thereof
- Patent number 9,036,093
- Issue date May 19, 2015
- Renesas Electronics Corporation
- Yoshihiko Hotta
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Coating liquid for forming insulation film, insulation film using t...
- Patent number 8,940,380
- Issue date Jan 27, 2015
- Adeka Corporation
- Kenji Hara
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Analog current output circuit
- Patent number 8,810,078
- Issue date Aug 19, 2014
- Mitsubishi Electric Corporation
- Seiichi Saito
- G05 - CONTROLLING REGULATING
Information Patent Grant
Semiconductor device and signal processing method thereof
- Patent number 8,767,131
- Issue date Jul 1, 2014
- Renesas Mobile Corporation
- Yoshihiko Hotta
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device and data processor
- Patent number 8,531,893
- Issue date Sep 10, 2013
- Renesas Electronics Corporation
- Yoshihiko Hotta
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Hardenable epoxy resin composition
- Patent number 8,426,504
- Issue date Apr 23, 2013
- Adeka Corporation
- Takahiro Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
HSP90 inhibitor
- Patent number 8,399,464
- Issue date Mar 19, 2013
- Nippon Kayaku Kabushiki Kaisha
- Hiroshi Kuramochi
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Semiconductor data processing device and data processing system
- Patent number 8,352,096
- Issue date Jan 8, 2013
- Renesas Electronics Corporation
- Seiichi Saito
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and data processor
- Patent number 8,339,869
- Issue date Dec 25, 2012
- Renesas Electronics Corporation
- Yoshihiko Hotta
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Positive photosensitive composition, positive permanent resist, and...
- Patent number 8,211,619
- Issue date Jul 3, 2012
- Adeka Corporation
- Hiroshi Morita
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Analog input device
- Patent number 8,120,367
- Issue date Feb 21, 2012
- Mitsubishi Electric Corporation
- Yoshihiro Akeboshi
- G01 - MEASURING TESTING
Information Patent Grant
Signal transmission circuit, IC package, and mounting board
- Patent number 8,081,487
- Issue date Dec 20, 2011
- Mitsubishi Denki Kabushiki Kaisha
- Keitaro Yamagishi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Modem apparatus
- Patent number 8,063,768
- Issue date Nov 22, 2011
- Mitsubishi Electric Corporation
- Yoshihiro Akeboshi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Data processor
- Patent number 8,044,964
- Issue date Oct 25, 2011
- Renesas Electronics Corporation
- Shuji Kurata
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and data processor
- Patent number 8,018,784
- Issue date Sep 13, 2011
- Renesas Electronics Corporation
- Yoshihiko Hotta
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Silicon-containing compound, curable composition and cured product
- Patent number 8,003,736
- Issue date Aug 23, 2011
- Adeka Corporation
- Takashi Sueyoshi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Analog input device
- Patent number 7,990,302
- Issue date Aug 2, 2011
- Mitsubishi Electric Corporation
- Seiichi Saito
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Analog insulation/multiplexer
- Patent number 7,973,588
- Issue date Jul 5, 2011
- Mitsubishi Electric Corporation
- Seiichi Saito
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor integrated circuit and operation method for the same
- Patent number 7,948,298
- Issue date May 24, 2011
- Renesas Electronics Corporation
- Tadashi Kameyama
- G05 - CONTROLLING REGULATING
Information Patent Grant
Epoxy resin curable composition for prepreg
- Patent number 7,906,213
- Issue date Mar 15, 2011
- Adeka Corporation
- Yoshinori Takahata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Analog multiplexer with insulation power supply
- Patent number 7,898,315
- Issue date Mar 1, 2011
- Mitsubishi Electric Corporation
- Seiichi Saito
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor integrated circuit and operation method for the same
- Patent number 7,782,119
- Issue date Aug 24, 2010
- Renesas Technology Corp.
- Tadashi Kameyama
- G05 - CONTROLLING REGULATING
Information Patent Grant
Vinyl ether curing composition
- Patent number 7,595,357
- Issue date Sep 29, 2009
- Adeka Corporation
- Seiichi Saito
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Signal transmission circuit, IC package, and mounting board
- Patent number 7,501,910
- Issue date Mar 10, 2009
- Mitsubishi Denki Kabushiki Kaisha
- Keitaro Yamagishi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Epoxy resin composition
- Patent number 7,294,660
- Issue date Nov 13, 2007
- Asahi Denka Co., Ltd.
- Seiichi Saito
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Information signal recording and playback method and apparatus ther...
- Patent number 7,019,927
- Issue date Mar 28, 2006
- Hitachi, Ltd.
- Seiichi Saito
- G11 - INFORMATION STORAGE
Information Patent Grant
Information signal recording and playback method and apparatus ther...
- Patent number 6,657,831
- Issue date Dec 2, 2003
- Hitachi, Ltd.
- Seiichi Saito
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND SIGNAL PROCESSING METHOD THEREOF
- Publication number 20150229419
- Publication date Aug 13, 2015
- RENESAS ELECTRONICS CORPORATION
- Yoshihiko Hotta
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR DEVICE AND SIGNAL PROCESSING METHOD THEREOF
- Publication number 20140241475
- Publication date Aug 28, 2014
- Renesas Mobile Corporation
- Yoshihiko Hotta
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PHOTOCURABLE RESIN COMPOSITION AND NOVEL SILOXANE COMPOUND
- Publication number 20140205949
- Publication date Jul 24, 2014
- ADEKA CORPORATION
- Kenji Hara
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
OPTICAL FIBER
- Publication number 20140199040
- Publication date Jul 17, 2014
- ADEKA CORPORATION
- Kazuyuki Sohma
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE
- Publication number 20140189259
- Publication date Jul 3, 2014
- Renesas Mobile Corporation
- Kenichiro Omura
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND SIGNAL PROCESSING METHOD THEREOF
- Publication number 20130242204
- Publication date Sep 19, 2013
- Renesas Mobile Corporation
- Yoshihiko Hotta
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR DEVICE AND DATA PROCESSOR
- Publication number 20130073765
- Publication date Mar 21, 2013
- RENESAS ELECTRONICS CORPORATION
- Yoshihiko HOTTA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COATING LIQUID FOR FORMING INSULATION FILM, INSULATION FILM USING T...
- Publication number 20120192761
- Publication date Aug 2, 2012
- Kenji Hara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR DEVICE AND DATA PROCESSOR
- Publication number 20110314323
- Publication date Dec 22, 2011
- Renesas Electronics Corporation
- Yoshihiko HOTTA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ANALOG CURRENT OUTPUT CIRCUIT
- Publication number 20110254527
- Publication date Oct 20, 2011
- MITSUBISHI ELECTRIC CORPORATION
- Seiichi Saito
- G05 - CONTROLLING REGULATING
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT AND OPERATION METHOD FOR THE SAME
- Publication number 20110204957
- Publication date Aug 25, 2011
- Renesas Electronics Corporation
- TADASHI KAMEYAMA
- G05 - CONTROLLING REGULATING
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT AND OPERATION METHOD FOR THE SAME
- Publication number 20100301924
- Publication date Dec 2, 2010
- RENESAS TECHNOLOGY CORP.
- Tadashi KAMEYAMA
- G05 - CONTROLLING REGULATING
Information Patent Application
POSITIVE PHOTOSENSITIVE COMPOSITION, POSITIVE PERMANENT RESIST, AND...
- Publication number 20100273104
- Publication date Oct 28, 2010
- A D E K A (ADEKA CORPORATION)
- Hiroshi Morita
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR DATA PROCESSING DEVICE AND DATA PROCESSING SYSTEM
- Publication number 20100274412
- Publication date Oct 28, 2010
- RENESAS TECHNOLOGY CORP.
- Seiichi Saito
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HARDENABLE EPOXY RESIN COMPOSITION
- Publication number 20100190899
- Publication date Jul 29, 2010
- ADEKA CORPORATION
- Takahiro Mori
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR DEVICE AND DATA PROCESSOR
- Publication number 20100182848
- Publication date Jul 22, 2010
- RENESAS TECHNOLOGY CORP.
- Yoshihiko Hotta
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SILICON-CONTAINING COMPOUND, CURABLE COMPOSITION AND CURED PRODUCT
- Publication number 20100179283
- Publication date Jul 15, 2010
- ADEKA CORPORATION
- Takashi Sueyoshi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ANALOG INPUT DEVICE
- Publication number 20100164772
- Publication date Jul 1, 2010
- MITSUBISHI ELECTRIC CORPORATION
- Seiichi Saito
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ANALOG MULTIPLEXER WITH INSULATION POWER SUPPLY
- Publication number 20100019828
- Publication date Jan 28, 2010
- Mitsubishi Electric Corporation
- Seiichi Saito
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT AND OPERATION METHOD FOR THE SAME
- Publication number 20090295458
- Publication date Dec 3, 2009
- RENESAS TECHNOLOGY CORP.
- Tadashi KAMEYAMA
- G05 - CONTROLLING REGULATING
Information Patent Application
ANALOG INPUT DEVICE
- Publication number 20090257260
- Publication date Oct 15, 2009
- MITSUBISHI ELECTRIC CORPORATION
- Yoshihiro Akeboshi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ANALOG INSULATION/MULTIPLEXER
- Publication number 20090066401
- Publication date Mar 12, 2009
- MITSUBISHI ELECTRIC CORPORATION
- Seiichi Saito
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Epoxy Resin Curable Composition For Prepreg
- Publication number 20090030147
- Publication date Jan 29, 2009
- ADEKA CORPORATION
- Yoshinori Takahata
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SIGNAL TRANSMISSION CIRCUIT, IC PACKAGE, AND MOUNTING BOARD
- Publication number 20080315975
- Publication date Dec 25, 2008
- KEITARO YAMAGISHI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Novel Hsp90 Inhibitor
- Publication number 20080269218
- Publication date Oct 30, 2008
- Hiroshi Kuramochi
- C07 - ORGANIC CHEMISTRY
Information Patent Application
Modem Apparatus
- Publication number 20080122587
- Publication date May 29, 2008
- Yoshihiro Akeboshi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
DATA PROCESSOR
- Publication number 20080049029
- Publication date Feb 28, 2008
- Shuji Kurata
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Signal transmission circuit, IC package, and mounting board
- Publication number 20060197679
- Publication date Sep 7, 2006
- Mitsubishi Denki Kabushiki Kaisha
- Keitaro Yamagishi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Vinyl ether curing composition
- Publication number 20060178454
- Publication date Aug 10, 2006
- ASAHI DENKA CO., LTD.
- Seiichi Saito
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Highly elastic epoxy resin composition
- Publication number 20060173101
- Publication date Aug 3, 2006
- ASAHI DENKA CO., LTD.
- Yoshinori Takahata
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Seiichi Saito

Person

Patents Grantslast 30 patents

Optical fiber

Semiconductor device and signal processing method thereof

Photocurable resin composition and novel siloxane compound

Semiconductor device and signal processing method thereof

Coating liquid for forming insulation film, insulation film using t...

Analog current output circuit

Semiconductor device and signal processing method thereof

Semiconductor device and data processor

Hardenable epoxy resin composition

HSP90 inhibitor

Semiconductor data processing device and data processing system

Semiconductor device and data processor

Positive photosensitive composition, positive permanent resist, and...

Analog input device

Signal transmission circuit, IC package, and mounting board

Modem apparatus

Data processor

Semiconductor device and data processor

Silicon-containing compound, curable composition and cured product

Analog input device

Analog insulation/multiplexer

Semiconductor integrated circuit and operation method for the same

Epoxy resin curable composition for prepreg

Analog multiplexer with insulation power supply

Semiconductor integrated circuit and operation method for the same

Vinyl ether curing composition

Signal transmission circuit, IC package, and mounting board

Epoxy resin composition

Information signal recording and playback method and apparatus ther...

Information signal recording and playback method and apparatus ther...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND SIGNAL PROCESSING METHOD THEREOF

SEMICONDUCTOR DEVICE AND SIGNAL PROCESSING METHOD THEREOF

PHOTOCURABLE RESIN COMPOSITION AND NOVEL SILOXANE COMPOUND

OPTICAL FIBER

SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE AND SIGNAL PROCESSING METHOD THEREOF

SEMICONDUCTOR DEVICE AND DATA PROCESSOR

COATING LIQUID FOR FORMING INSULATION FILM, INSULATION FILM USING T...

SEMICONDUCTOR DEVICE AND DATA PROCESSOR

ANALOG CURRENT OUTPUT CIRCUIT

SEMICONDUCTOR INTEGRATED CIRCUIT AND OPERATION METHOD FOR THE SAME

SEMICONDUCTOR INTEGRATED CIRCUIT AND OPERATION METHOD FOR THE SAME

POSITIVE PHOTOSENSITIVE COMPOSITION, POSITIVE PERMANENT RESIST, AND...

SEMICONDUCTOR DATA PROCESSING DEVICE AND DATA PROCESSING SYSTEM

HARDENABLE EPOXY RESIN COMPOSITION

SEMICONDUCTOR DEVICE AND DATA PROCESSOR

SILICON-CONTAINING COMPOUND, CURABLE COMPOSITION AND CURED PRODUCT

ANALOG INPUT DEVICE

ANALOG MULTIPLEXER WITH INSULATION POWER SUPPLY

SEMICONDUCTOR INTEGRATED CIRCUIT AND OPERATION METHOD FOR THE SAME

ANALOG INPUT DEVICE

ANALOG INSULATION/MULTIPLEXER

Epoxy Resin Curable Composition For Prepreg

SIGNAL TRANSMISSION CIRCUIT, IC PACKAGE, AND MOUNTING BOARD

Novel Hsp90 Inhibitor

Modem Apparatus

DATA PROCESSOR

Signal transmission circuit, IC package, and mounting board

Vinyl ether curing composition

Highly elastic epoxy resin composition