Seiichi Sato

Person

Chikushino, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Paste applicator and paste application method for die bonding
- Patent number 6,685,777
- Issue date Feb 3, 2004
- Matsushita Electric Industrial Co., Ltd.
- Seiichi Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding paste applicator and method of using it
- Patent number 6,605,315
- Issue date Aug 12, 2003
- Matsushita Electric Industrial Co., Ltd.
- Mitsuru Ozono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of applying bonding paste
- Patent number 6,460,756
- Issue date Oct 8, 2002
- Matsushita Electric Industrial Co., Ltd.
- Mitsuru Ozono
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Paste application method for die bonding
- Patent number 6,361,831
- Issue date Mar 26, 2002
- Matsushita Electric Industrial Co., Ltd.
- Seiichi Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Paste applying method
- Patent number 6,348,234
- Issue date Feb 19, 2002
- Matsushita Electric Industrial Co., Ltd.
- Mitsuru Ozono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal compression bonding method of electronic part with solder bump
- Patent number 6,131,795
- Issue date Oct 17, 2000
- Matsushita Electric Industrial Co., Ltd.
- Seiichi Sato
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip compression-bonding apparatus and method
- Patent number 5,985,064
- Issue date Nov 16, 1999
- Matsushita Electric Industrial Co., Ltd.
- Seiichi Sato
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for mounting a chip
- Patent number 5,839,187
- Issue date Nov 24, 1998
- Matsushita Electric Industrial Co., Ltd.
- Seiichi Sato
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Paste applicator and paste application method for die bonding
- Publication number 20020037372
- Publication date Mar 28, 2002
- Seiichi Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of applying bonding paste
- Publication number 20020014519
- Publication date Feb 7, 2002
- Mitsuru Ozono
- H01 - BASIC ELECTRIC ELEMENTS

Seiichi Sato

Person

Patents Grantslast 30 patents

Paste applicator and paste application method for die bonding

Bonding paste applicator and method of using it

Method of applying bonding paste

Paste application method for die bonding

Paste applying method

Thermal compression bonding method of electronic part with solder bump

Chip compression-bonding apparatus and method

Apparatus and method for mounting a chip

Patents Applicationslast 30 patents

Paste applicator and paste application method for die bonding

Method of applying bonding paste