Seiichi Tajima

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Device-embedded board and method of manufacturing the same
- Patent number 11,412,621
- Issue date Aug 9, 2022
- TDK Corporation
- Takaaki Morita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 11,382,218
- Issue date Jul 5, 2022
- TDK Corporation
- Takaaki Morita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 10,905,013
- Issue date Jan 26, 2021
- TDK Corporation
- Takaaki Morita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic circuit module component and method of manufacturing ele...
- Patent number 8,929,089
- Issue date Jan 6, 2015
- TDK Corporation
- Shigeru Asami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and manufacturing same
- Patent number 7,134,196
- Issue date Nov 14, 2006
- TDK Corporation
- Bunji Moriya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method for a piezoelectric component
- Patent number 6,604,266
- Issue date Aug 12, 2003
- TDK Corporation
- Seiichi Tajima
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Piezoelectric device with sealed vibration space and manufacturing...
- Patent number 6,475,823
- Issue date Nov 5, 2002
- TDK Corporation
- Shigeru Sakano
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Piezoelectric component and manufacturing method thereof
- Patent number 6,114,795
- Issue date Sep 5, 2000
- TDK Corporation
- Seiichi Tajima
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
DEVICE-EMBEDDED BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200315034
- Publication date Oct 1, 2020
- TDK Corporation
- Takaaki MORITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190373739
- Publication date Dec 5, 2019
- TDK Corporation
- Takaaki MORITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190373742
- Publication date Dec 5, 2019
- TDK Corporation
- Takaaki MORITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC CIRCUIT MODULE COMPONENT AND METHOD OF MANUFACTURING ELE...
- Publication number 20110229708
- Publication date Sep 22, 2011
- TDK Corporation
- Shigeru ASAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT BUILT-IN MODULE AND METHOD OF MANUFACTURING TH...
- Publication number 20110198115
- Publication date Aug 18, 2011
- TDK Corporation
- Yukihiro AZUMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic device and manufacturing same
- Publication number 20040177498
- Publication date Sep 16, 2004
- TDK Corporation
- Bunji Moriya
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electronic device and manufacturing same
- Publication number 20020097562
- Publication date Jul 25, 2002
- TDK Corporation
- Bunji Moriya
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Seiichi Tajima

Person

Patents Grantslast 30 patents

Device-embedded board and method of manufacturing the same

Printed wiring board and method for manufacturing the same

Printed wiring board and method for manufacturing the same

Electronic circuit module component and method of manufacturing ele...

Electronic device and manufacturing same

Manufacturing method for a piezoelectric component

Piezoelectric device with sealed vibration space and manufacturing...

Piezoelectric component and manufacturing method thereof

Patents Applicationslast 30 patents

DEVICE-EMBEDDED BOARD AND METHOD OF MANUFACTURING THE SAME

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC CIRCUIT MODULE COMPONENT AND METHOD OF MANUFACTURING ELE...

ELECTRONIC COMPONENT BUILT-IN MODULE AND METHOD OF MANUFACTURING TH...

Electronic device and manufacturing same

Electronic device and manufacturing same