Seiichi Watanabe

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Taiwa-cho, JP

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Patents Grantslast 30 patents

Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 11,501,976
- Issue date Nov 15, 2022
- Tokyo Electron Limited
- Seiichi Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method and substrate processing apparatus
- Patent number 11,121,000
- Issue date Sep 14, 2021
- Tokyo Electron Limited
- Seiichi Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface modification control for etch metric enhancement
- Patent number 10,446,453
- Issue date Oct 15, 2019
- Tokyo Electron Limited
- Brian J. Coppa
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20210265170
- Publication date Aug 26, 2021
- TOKYO ELECTRON LIMITED
- Seiichi WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20210043461
- Publication date Feb 11, 2021
- TOKYO ELECTRON LIMITED
- Seiichi WATANABE
- H01 - BASIC ELECTRIC ELEMENTS