Seiichirou ITOU

Person

Kirishima, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wiring board, electronic device, and electronic module
- Patent number 12,028,970
- Issue date Jul 2, 2024
- Kyocera Corporation
- Seiichirou Itou
- G01 - MEASURING TESTING
Information Patent Grant
Wiring substrate, electronic device, and electronic module
- Patent number 11,735,507
- Issue date Aug 22, 2023
- Kyocera Corporation
- Seiichirou Itou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate
- Patent number 11,589,457
- Issue date Feb 21, 2023
- Kyocera Corporation
- Seiichirou Itou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and electronic device
- Patent number 11,395,405
- Issue date Jul 19, 2022
- Kyocera Corporation
- Seiichirou Itou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting substrate and light emission device u...
- Patent number 9,842,971
- Issue date Dec 12, 2017
- KYOCERA Corporation
- Seiichirou Itou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for a probe card assembly
- Patent number 8,378,704
- Issue date Feb 19, 2013
- Kyocera Corporation
- Seiichirou Itou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SiC POLYCRYSTAL MANUFACTURING METHOD
- Publication number 20230357955
- Publication date Nov 9, 2023
- KYOCERA CORPORATION
- Seiichirou ITOU
- C30 - CRYSTAL GROWTH
Information Patent Application
SiC CRYSTAL MANUFACTURING METHOD
- Publication number 20230243063
- Publication date Aug 3, 2023
- KYOCERA CORPORATION
- Seiichirou ITOU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WIRING SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
- Publication number 20220367183
- Publication date Nov 17, 2022
- KYOCERA CORPORATION
- Seiichirou ITOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
- Publication number 20220353987
- Publication date Nov 3, 2022
- KYOCERA CORPORATION
- Seiichirou ITOU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
- Publication number 20220192013
- Publication date Jun 16, 2022
- KYOCERA CORPORATION
- Seiichirou ITOU
- G01 - MEASURING TESTING
Information Patent Application
WIRING SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
- Publication number 20220077045
- Publication date Mar 10, 2022
- KYOCERA CORPORATION
- Seiichirou ITOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND ELECTRONIC DEVICE
- Publication number 20210243892
- Publication date Aug 5, 2021
- KYOCERA CORPORATION
- Seiichirou ITOU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20210127486
- Publication date Apr 29, 2021
- KYOCERA CORPORATION
- Seiichirou ITOU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MOUNTING SUBSTRATE AND LIGHT EMISSION DEVICE U...
- Publication number 20170207369
- Publication date Jul 20, 2017
- KYOCERA CORPORATION
- Seiichirou ITOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR PROBE CARD ASSEMBLY, METHOD OF MANUFACTURING SUBSTRAT...
- Publication number 20080180118
- Publication date Jul 31, 2008
- Kyocera Corporation
- Seiichirou ITOU
- G01 - MEASURING TESTING

Seiichirou ITOU

Person

Patents Grantslast 30 patents

Wiring board, electronic device, and electronic module

Wiring substrate, electronic device, and electronic module

Wiring substrate

Wiring substrate and electronic device

Electronic component mounting substrate and light emission device u...

Substrate for a probe card assembly

Patents Applicationslast 30 patents

SiC POLYCRYSTAL MANUFACTURING METHOD

SiC CRYSTAL MANUFACTURING METHOD

WIRING SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

WIRING SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

WIRING SUBSTRATE AND ELECTRONIC DEVICE

WIRING BOARD

ELECTRONIC COMPONENT MOUNTING SUBSTRATE AND LIGHT EMISSION DEVICE U...

SUBSTRATE FOR PROBE CARD ASSEMBLY, METHOD OF MANUFACTURING SUBSTRAT...