Seiji Harada

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Gettering layer forming method
- Patent number 10,546,758
- Issue date Jan 28, 2020
- Disco Corporation
- Daigo Shitabo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gettering layer forming method
- Patent number 10,541,149
- Issue date Jan 21, 2020
- Disco Corporation
- Seiji Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Workpiece evaluating method
- Patent number 10,157,802
- Issue date Dec 18, 2018
- Disco Corporation
- Naoya Sukegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing method and electronic device
- Patent number 9,786,490
- Issue date Oct 10, 2017
- Disco Corporation
- Seiji Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Evaluation method of device wafer
- Patent number 9,679,820
- Issue date Jun 13, 2017
- Disco Corporation
- Naoya Sukegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated wafer processing method
- Patent number 9,543,189
- Issue date Jan 10, 2017
- Disco Corporation
- Seiji Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Software installing method based on acquired equipment information...
- Patent number 8,930,943
- Issue date Jan 6, 2015
- Konica Minolta, Inc.
- Seiji Harada
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printing instruction program, image forming apparatus and method fo...
- Patent number 8,896,878
- Issue date Nov 25, 2014
- Konica Minolta Business Technologies, Inc.
- Seiji Harada
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Program and method for providing predetermined processing with regi...
- Patent number 8,707,207
- Issue date Apr 22, 2014
- Konica Minolta Business Technologies, Inc.
- Yoshiyuki Harada
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Computer readable storage medium storing a program, image processin...
- Patent number 8,526,064
- Issue date Sep 3, 2013
- Konica Minolta Business Technologies, Inc.
- Seiji Harada
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Wafer processing method
- Patent number 8,524,576
- Issue date Sep 3, 2013
- Disco Corporation
- Seiji Harada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Software installing method based on acquired equipment information...
- Patent number 8,479,191
- Issue date Jul 2, 2013
- Konica Minolta Business Technologies, Inc.
- Seiji Harada
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Device processing method
- Patent number 8,461,020
- Issue date Jun 11, 2013
- Disco Corporation
- Seiji Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control device setting method and program
- Patent number 8,407,695
- Issue date Mar 26, 2013
- Konica Minolta Business Technologies, Inc.
- Seiji Harada
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of manufacturing semiconductor wafer
- Patent number 8,283,252
- Issue date Oct 9, 2012
- Sumitomo Mitsubishi Silicon Corporation
- Toru Taniguchi
- B24 - GRINDING POLISHING
Information Patent Grant
Grinding method for wafer
- Patent number 7,677,955
- Issue date Mar 16, 2010
- Disco Corporation
- Keiichi Kajiyama
- B24 - GRINDING POLISHING
Information Patent Grant
Method of manufacturing semiconductor wafer
- Patent number 7,589,023
- Issue date Sep 15, 2009
- Sumitomo Mitsubishi Silicon Corporation
- Toru Taniguchi
- B24 - GRINDING POLISHING
Information Patent Grant
Method of polishing semiconductor wafers by using double-sided poli...
- Patent number 7,470,169
- Issue date Dec 30, 2008
- Sumitomo Mitsubishi Silicon Corporation
- Toru Taniguchi
- B24 - GRINDING POLISHING
Information Patent Grant
Printing device, printing method, printing program and computer-rea...
- Patent number 7,296,873
- Issue date Nov 20, 2007
- Konica Minolta Business Technologies, Inc.
- Seiji Harada
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
GETTERING LAYER FORMING METHOD
- Publication number 20180323080
- Publication date Nov 8, 2018
- Disco Corporation
- Seiji Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GETTERING LAYER FORMING METHOD
- Publication number 20180323081
- Publication date Nov 8, 2018
- Disco Corporation
- Daigo Shitabo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE EVALUATING METHOD
- Publication number 20170278759
- Publication date Sep 28, 2017
- Disco Corporation
- Naoya Sukegawa
- G01 - MEASURING TESTING
Information Patent Application
RESIN COMPOSITION AND FIXING METHOD FOR PLATE-SHAPED WORKPIECE
- Publication number 20170233609
- Publication date Aug 17, 2017
- Disco Corporation
- Seiji Harada
- B32 - LAYERED PRODUCTS
Information Patent Application
WAFER PROCESSING METHOD AND ELECTRONIC DEVICE
- Publication number 20170047221
- Publication date Feb 16, 2017
- Disco Corporation
- Seiji Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EVALUATION METHOD OF DEVICE WAFER
- Publication number 20150377779
- Publication date Dec 31, 2015
- Disco Corporation
- Naoya Sukegawa
- G01 - MEASURING TESTING
Information Patent Application
LAMINATED WAFER PROCESSING METHOD
- Publication number 20150037962
- Publication date Feb 5, 2015
- Disco Corporation
- Seiji Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER PROCESSING METHOD AND FINE PARTICLE LAYER FORMING AGENT
- Publication number 20140175070
- Publication date Jun 26, 2014
- Disco Corporation
- Yukinobu Ohura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOFTWARE INSTALLING METHOD BASED ON ACQUIRED EQUIPMENT INFORMATION...
- Publication number 20130268928
- Publication date Oct 10, 2013
- Konica Minolta Business Technologies, Inc.
- Seiji Harada
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20120289060
- Publication date Nov 15, 2012
- Disco Corporation
- Seiji Harada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DEVICE PROCESSING METHOD
- Publication number 20120289027
- Publication date Nov 15, 2012
- Disco Corporation
- Seiji Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTING INSTRUCTION PROGRAM, IMAGE FORMING APPARATUS AND METHOD FO...
- Publication number 20120133980
- Publication date May 31, 2012
- Konica Minolta Business Technologies, Inc.
- Seiji HARADA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COMPUTER READABLE STORAGE MEDIUM STORING PROGRAM, IMAGE PROCESSING...
- Publication number 20110122453
- Publication date May 26, 2011
- Konica Minolta Business Technologies, Inc.
- Seiji Harada
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ITEM SETTING APPARATUS, CONTROL METHOD AND CONTROL PROGRAM FOR THE...
- Publication number 20100199209
- Publication date Aug 5, 2010
- Konica Minolta Business Technologies, Inc.
- Chie SUEOKA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Item Setting Device, Control Method and Control Program for the Device
- Publication number 20100199210
- Publication date Aug 5, 2010
- Konica Minolta Business Technologies, Inc.
- Seiji Harada
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ITEM SETTING DEVICE, CONTROL METHOD AND CONTROL PROGRAM FOR THE DEVICE
- Publication number 20100199211
- Publication date Aug 5, 2010
- Konica Minolta Business Technologies, Inc.
- Shin IGAWA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PROGRAM AND METHOD FOR PROVIDING PREDETERMINED PROCESSING WITH REGI...
- Publication number 20100115464
- Publication date May 6, 2010
- Konica Minolta Business Technologies, Inc.
- Yoshiyuki HARADA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONTROL DEVICE SETTING METHOD AND PROGRAM
- Publication number 20100095295
- Publication date Apr 15, 2010
- Konica Minolta Business Technologies, Inc.
- Seiji HARADA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method of manufacturing semiconductor wafer
- Publication number 20100009605
- Publication date Jan 14, 2010
- Toru Taniguchi
- B24 - GRINDING POLISHING
Information Patent Application
GRINDING METHOD FOR WAFER
- Publication number 20090098808
- Publication date Apr 16, 2009
- Disco Corporation
- Keiichi Kajiyama
- B24 - GRINDING POLISHING
Information Patent Application
Software installing method and storage medium
- Publication number 20070288916
- Publication date Dec 13, 2007
- KONICA MINOLTA BUSINESS TECHNOLOGIES, INC.
- Seiji Harada
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Manufacturing method for semiconductor wafers, slicing method for s...
- Publication number 20060258268
- Publication date Nov 16, 2006
- NIPPEI TOYAMA CORPORATION & DISCO CORPORATION
- Kensyo Miyata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Audio data interpolation apparatus
- Publication number 20060156159
- Publication date Jul 13, 2006
- Seiji Harada
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Application
Printing device, printing method, printing program and computer-rea...
- Publication number 20050078165
- Publication date Apr 14, 2005
- Konica Minolta Business Technologies, Inc.
- Seiji Harada
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Program, method, and device for monitoring job
- Publication number 20040212818
- Publication date Oct 28, 2004
- Konica Minolta Business Technologies, Inc.
- Seiji Harada
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method of polishing semiconductor wafers by using double-sided poli...
- Publication number 20030181141
- Publication date Sep 25, 2003
- Toru Taniguchi
- B24 - GRINDING POLISHING
Information Patent Application
Method of manufacturing semiconductor wafer
- Publication number 20030104698
- Publication date Jun 5, 2003
- Toru Taniguchi
- B24 - GRINDING POLISHING

Seiji Harada

Person

Patents Grantslast 30 patents

Gettering layer forming method

Gettering layer forming method

Workpiece evaluating method

Wafer processing method and electronic device

Evaluation method of device wafer

Laminated wafer processing method

Software installing method based on acquired equipment information...

Printing instruction program, image forming apparatus and method fo...

Program and method for providing predetermined processing with regi...

Computer readable storage medium storing a program, image processin...

Wafer processing method

Software installing method based on acquired equipment information...

Device processing method

Control device setting method and program

Method of manufacturing semiconductor wafer

Grinding method for wafer

Method of manufacturing semiconductor wafer

Method of polishing semiconductor wafers by using double-sided poli...

Printing device, printing method, printing program and computer-rea...

Patents Applicationslast 30 patents

GETTERING LAYER FORMING METHOD

GETTERING LAYER FORMING METHOD

WORKPIECE EVALUATING METHOD

RESIN COMPOSITION AND FIXING METHOD FOR PLATE-SHAPED WORKPIECE

WAFER PROCESSING METHOD AND ELECTRONIC DEVICE

EVALUATION METHOD OF DEVICE WAFER

LAMINATED WAFER PROCESSING METHOD

LASER PROCESSING METHOD AND FINE PARTICLE LAYER FORMING AGENT

SOFTWARE INSTALLING METHOD BASED ON ACQUIRED EQUIPMENT INFORMATION...

WAFER PROCESSING METHOD

DEVICE PROCESSING METHOD

PRINTING INSTRUCTION PROGRAM, IMAGE FORMING APPARATUS AND METHOD FO...

COMPUTER READABLE STORAGE MEDIUM STORING PROGRAM, IMAGE PROCESSING...

ITEM SETTING APPARATUS, CONTROL METHOD AND CONTROL PROGRAM FOR THE...

Item Setting Device, Control Method and Control Program for the Device

ITEM SETTING DEVICE, CONTROL METHOD AND CONTROL PROGRAM FOR THE DEVICE

PROGRAM AND METHOD FOR PROVIDING PREDETERMINED PROCESSING WITH REGI...

CONTROL DEVICE SETTING METHOD AND PROGRAM

Method of manufacturing semiconductor wafer

GRINDING METHOD FOR WAFER

Software installing method and storage medium

Manufacturing method for semiconductor wafers, slicing method for s...

Audio data interpolation apparatus

Printing device, printing method, printing program and computer-rea...

Program, method, and device for monitoring job

Method of polishing semiconductor wafers by using double-sided poli...

Method of manufacturing semiconductor wafer