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Seiji Karashima
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Hirakata, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Electronic component assembly
Patent number
9,426,899
Issue date
Aug 23, 2016
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Takashi Kitae
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electrode structure and method for forming bump
Patent number
8,887,383
Issue date
Nov 18, 2014
Panasonic Corporation
Yasushi Taniguchi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Flip-chip mounting resin composition and bump forming resin composi...
Patent number
8,709,293
Issue date
Apr 29, 2014
Panasonic Corporation
Takashi Kitae
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Flip-chip mounting method and bump formation method
Patent number
8,691,683
Issue date
Apr 8, 2014
Panasonic Corporation
Koichi Hirano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for connecting between substrates, flip-chip mounting struct...
Patent number
8,501,583
Issue date
Aug 6, 2013
Panasonic Corporation
Takashi Kitae
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bump forming method using self-assembling resin and a wall surface
Patent number
8,297,488
Issue date
Oct 30, 2012
Panasonic Corporation
Seiji Karashima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Flip chip mounting method and bump forming method
Patent number
8,283,246
Issue date
Oct 9, 2012
Panasonic Corporation
Takashi Kitae
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Flip chip connection structure having powder-like conductive substa...
Patent number
8,097,958
Issue date
Jan 17, 2012
Panasonic Corporation
Susumu Sawada
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Flip chip mounting body, flip chip mounting method and flip chip mo...
Patent number
8,071,425
Issue date
Dec 6, 2011
Panasonic Corporation
Seiichi Nakatani
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Module with a built-in component, and electronic device with the same
Patent number
8,064,213
Issue date
Nov 22, 2011
Panasonic Corporation
Toshiyuki Asahi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Flip chip mounting process and flip chip assembly
Patent number
8,012,801
Issue date
Sep 6, 2011
Panasonic Corporation
Seiji Karashima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Flip chip mounting method and bump forming method
Patent number
7,951,700
Issue date
May 31, 2011
Panasonic Corporation
Takashi Kitae
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Flip-chip mounting method and bump formation method
Patent number
7,927,997
Issue date
Apr 19, 2011
Panasonic Corporation
Koichi Hirano
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electronic component mounting method
Patent number
7,921,551
Issue date
Apr 12, 2011
Panasonic Corporation
Yoshihisa Yamashita
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for mutually connecting substrates, flip chip mounting body,...
Patent number
7,919,357
Issue date
Apr 5, 2011
Panasonic Corporation
Susumu Sawada
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Metal particles-dispersed composition and flip chip mounting proces...
Patent number
7,910,403
Issue date
Mar 22, 2011
Panasonic Corporation
Koichi Hirano
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Mounted body and method for manufacturing the same
Patent number
7,911,064
Issue date
Mar 22, 2011
Panasonic Corporation
Shingo Komatsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bump forming method and bump forming apparatus
Patent number
7,905,011
Issue date
Mar 15, 2011
Panasonic Corporation
Yasushi Taniguchi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Flip chip mounting method, flip chip mounting apparatus and flip ch...
Patent number
7,875,496
Issue date
Jan 25, 2011
Panasonic Corporation
Seiichi Nakatani
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Flip chip mounting method and method for connecting substrates
Patent number
7,820,021
Issue date
Oct 26, 2010
Panasonic Corporation
Seiji Karashima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Process for forming bumps and solder bump
Patent number
7,799,607
Issue date
Sep 21, 2010
Panasonic Corporation
Seiji Karashima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Flip chip mounting process and flip chip assembly
Patent number
7,759,162
Issue date
Jul 20, 2010
Panasonic Corporation
Seiji Karashima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Flip chip mounting body and method for mounting such flip chip moun...
Patent number
7,754,529
Issue date
Jul 13, 2010
Panasonic Corporation
Yoshihiro Tomita
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for producing connection member
Patent number
7,748,110
Issue date
Jul 6, 2010
Panasonic Corporation
Toshiyuki Asahi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Flip chip mounting body, flip chip mounting method and flip chip mo...
Patent number
7,732,920
Issue date
Jun 8, 2010
Panasonic Corporation
Seiichi Nakatani
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flip chip mounting process and bump-forming process using electrica...
Patent number
7,726,545
Issue date
Jun 1, 2010
Panasonic Corporation
Takashi Ichiryu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Conductive resin composition, connection method between electrodes...
Patent number
7,714,444
Issue date
May 11, 2010
Panasonic Corporation
Seiichi Nakatani
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
System-in-package optical transceiver in optical communication with...
Patent number
7,689,129
Issue date
Mar 30, 2010
Panasonic Corporation
Seiji Karashima
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Package equipped with semiconductor chip and method for producing same
Patent number
7,649,267
Issue date
Jan 19, 2010
Panasonic Corporation
Tsukasa Shiraishi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electronic component transporting method
Patent number
7,640,654
Issue date
Jan 5, 2010
Panasonic Corporation
Seiichi Nakatani
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
FLIP CHIP MOUNTING METHOD AND BUMP FORMING METHOD
Publication number
20110201195
Publication date
Aug 18, 2011
PANASONIC CORPORATION
Takashi KITAE
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
FLIP-CHIP MOUNTING METHOD AND BUMP FORMATION METHOD
Publication number
20110162578
Publication date
Jul 7, 2011
PANASONIC CORPORATION
Koichi Hirano
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METAL PARTICLES-DISPERSED COMPOSITION AND FLIP CHIP MOUNTING PROCES...
Publication number
20110133137
Publication date
Jun 9, 2011
Koichi Hirano
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
FLIP CHIP MOUNTING BODY, FLIP CHIP MOUNTING METHOD AND FLIP CHIP MO...
Publication number
20100203675
Publication date
Aug 12, 2010
PANASONIC CORPORATION
Seiichi NAKATANI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLIP CHIP MOUNTING PROCESS AND FLIP CHIP ASSEMBLY
Publication number
20100148376
Publication date
Jun 17, 2010
Seiji Karashima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ELECTRODE STRUCTURE AND METHOD FOR FORMING BUMP
Publication number
20100044091
Publication date
Feb 25, 2010
PANASONIC CORPORATION
Yasushi Taniguchi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ELECTRONIC COMPONENT ASSEMBLY, ELECTRIC COMPONENT WITH SOLDER BUMP...
Publication number
20100011572
Publication date
Jan 21, 2010
Takashi Kitae
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
METHOD FOR CONNECTING BETWEEN SUBSTRATES, FLIP-CHIP MOUNTING STRUCT...
Publication number
20100007033
Publication date
Jan 14, 2010
Takashi KITAE
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
METHOD FOR MUTUALLY CONNECTING SUBSTRATES, FLIP CHIP MOUNTING BODY,...
Publication number
20100001411
Publication date
Jan 7, 2010
Susumu SAWADA
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
BUMP FORMING METHOD AND BUMP FORMING APPARATUS
Publication number
20090229120
Publication date
Sep 17, 2009
Yasushi Taniguchi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MOUNTED BODY AND METHOD FOR MANUFACTURING THE SAME
Publication number
20090230546
Publication date
Sep 17, 2009
Matsushita Electric Industrial Co., Ltd.
Shingo Komatsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electronic Component Mounting Method and Electronic Circuit Device
Publication number
20090223705
Publication date
Sep 10, 2009
Yoshihisa Yamashita
B30 - PRESSES
Information
Patent Application
FLIP CHIP MOUNTING METHOD, FLIP CHIP MOUNTING APPARATUS AND FLIP CH...
Publication number
20090203170
Publication date
Aug 13, 2009
Matsushita Electric Industrial Co., Ltd.
Seiichi Nakatani
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
CONDUCTIVE RESIN COMPOSITION, CONNECTION METHOD BETWEEN ELECTRODES...
Publication number
20090200522
Publication date
Aug 13, 2009
PANASONIC CORPORATION
Seiichi NAKATANI
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
FLIP CHIP MOUNTING BODY AND METHOD FOR MOUNTING SUCH FLIP CHIP MOUN...
Publication number
20090203169
Publication date
Aug 13, 2009
Matsushita Electric Industrial Co., Ltd.
Yoshihiro Tomita
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
METHOD FOR FORMING CONDUCTIVE PATTERN AND WIRING BOARD
Publication number
20090133901
Publication date
May 28, 2009
Seiji Karashima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Flip chip mounting method and method for connecting substrates
Publication number
20090126876
Publication date
May 21, 2009
Matsushita Electric Industrial Co., Ltd.
Seiji Karashima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
FLIP CHIP MOUNTING METHOD AND METHOD FOR CONNECTING SUBSTRATES
Publication number
20090115071
Publication date
May 7, 2009
Seiji Karashima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
FLIP CHIP MOUNTING METHOD AND BUMP FORMING METHOD
Publication number
20090117688
Publication date
May 7, 2009
Seiji Karashima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CONNECTION STRUCTURE AND METHOD OF PRODUCING THE SAME
Publication number
20090102064
Publication date
Apr 23, 2009
PANASONIC CORPORATION
Susumu Sawada
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
FLIP-CHIP MOUNTING BODY AND FLIP-CHIP MOUNTING METHOD
Publication number
20090085227
Publication date
Apr 2, 2009
Matsushita Electric Industrial Co., Ltd.
Tsukasa Shiraishi
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
BUMP FORMING METHOD AND BUMP FORMING APPARATUS
Publication number
20090078746
Publication date
Mar 26, 2009
Seiji Karashima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
FLIP CHIP MOUNTING METHOD AND BUMP FORMING METHOD
Publication number
20090023245
Publication date
Jan 22, 2009
Matsushita Electric Industrial Co., Ltd.
Takashi Kitae
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
FLIP CHIP MOUNTING BODY, FLIP CHIP MOUNTING METHOD AND FLIP CHIP MO...
Publication number
20090008800
Publication date
Jan 8, 2009
Matsushita Electric Industrial Co., Ltd.
Seiichi Nakatani
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electronic Component Mounted Body, Electronic Component with Solder...
Publication number
20090008776
Publication date
Jan 8, 2009
Takashi Kitae
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Flip chip mounting method and bump forming method
Publication number
20080284046
Publication date
Nov 20, 2008
Matsushita Electric Industrial Co., Ltd.
Seiji Karashima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Package Equipped with Semiconductor Chip and Method for Producing Same
Publication number
20080265437
Publication date
Oct 30, 2008
Tsukasa Shiraishi
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Flip Clip Mounting Process And Bump-Forming Process Using Electrica...
Publication number
20080165518
Publication date
Jul 10, 2008
Takashi Ichiryu
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Metal Particles-Dispersed Composition and Flip Chip Mounting Proces...
Publication number
20080142966
Publication date
Jun 19, 2008
Koichi Hirano
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Flip-Chip Mounting Resin Composition and Bump Forming Resin Composi...
Publication number
20080128664
Publication date
Jun 5, 2008
Takashi Kitae
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...