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KAWASAKI-SHI, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Electronic component package, printed circuit board, and method of...
Patent number
6,727,718
Issue date
Apr 27, 2004
Fujistu Limited
Yasuhiro Ichihara
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electronic component package, printing circuit board, and method of...
Patent number
6,498,307
Issue date
Dec 24, 2002
Fujitsu Limited
Yasuhiro Ichihara
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of producing wire-bonded substrate assembly
Patent number
5,337,467
Issue date
Aug 16, 1994
Fujitsu Limited
Seiji Kogure
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for encapsulting IC chip
Patent number
5,182,853
Issue date
Feb 2, 1993
Fujitsu Limited
Yasushi Kobayashi
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Electronic component package, printed circuit board, and method of...
Publication number
20030063448
Publication date
Apr 3, 2003
FUJITSU LIMITED
YASUHIRO ICHIHARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC COMPONENT PACKAGE, PRINTING CIRCUIT BOARD, AND METHOD OF...
Publication number
20010030057
Publication date
Oct 18, 2001
FUJITSU LIMITED
YASUHIRO ICHIHARA
H01 - BASIC ELECTRIC ELEMENTS