Seiji Miyamoto

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Tachikawa, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packaging substrate and semiconductor device
- Patent number 8,319,345
- Issue date Nov 27, 2012
- Hitachi, Ltd.
- Tatsunobu Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,151,319
- Issue date Dec 19, 2006
- Hitachi, Ltd.
- Takashi Iida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,035,081
- Issue date Apr 25, 2006
- Hitachi, Ltd.
- Tatsuya Nagata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 6,747,356
- Issue date Jun 8, 2004
- Hitachi, Ltd.
- Hideko Ando
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having leads for mounting to a surface of a pr...
- Patent number 5,067,007
- Issue date Nov 19, 1991
- Hitachi, Ltd.
- Kanji Otsuka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGING SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20110062593
- Publication date Mar 17, 2011
- Hitachi, Ltd.
- Tatsunobu ABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20050017357
- Publication date Jan 27, 2005
- Takashi Iida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20040169198
- Publication date Sep 2, 2004
- Tatsuya Nagata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device
- Publication number 20030173640
- Publication date Sep 18, 2003
- Hitachi, Ltd.
- Hideko Ando
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR