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Seiji Nagatani

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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SURFACE-TREATED COPPER FOIL
    • Publication number 20110189503
    • Publication date Aug 4, 2011
    • Mitsui Mining and Smelting Co., Ltd.
    • Seiji Nagatani
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    COPPER FOIL WITH CARRIER SHEET, METHOD FOR MANUFACTURING COPPER FOI...
    • Publication number 20090291319
    • Publication date Nov 26, 2009
    • Mitsui Mining and Smelting Co., Ltd.
    • Seiji Nagatani
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Copper Foil and Method of Manufacturing the Same
    • Publication number 20080280159
    • Publication date Nov 13, 2008
    • Mitsui Mining and Smelting Co., Ltd.
    • Kenichiro Iwakiri
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    COPPER CLAD LAMINATE
    • Publication number 20080171220
    • Publication date Jul 17, 2008
    • Mitsui Mining and Smelting Co., Ltd.
    • Takuya Yamamoto
    • B32 - LAYERED PRODUCTS
  • Information Patent Application

    Electrodeposited Copper Foil with Carrier Foil on which a Resin Lay...
    • Publication number 20070207337
    • Publication date Sep 6, 2007
    • Mitsui Mining and Smelting Co., Ltd.
    • Seiji Nagatani
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Electrodeposited copper foil with carrier foil
    • Publication number 20040241487
    • Publication date Dec 2, 2004
    • Seiji Nagatani
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Copper clad laminate
    • Publication number 20020041032
    • Publication date Apr 11, 2002
    • MITSUI MINING AND SMELTING CO., LTD
    • Takuya Yamamoto
    • B32 - LAYERED PRODUCTS