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Seiji Nishizawa
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Hamura, JP
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last 30 patents
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Patent Grant
Apparatus and method for measuring thickness of thin semiconductor...
Patent number
5,587,792
Issue date
Dec 24, 1996
Seiji Nishizawa
G01 - MEASURING TESTING
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Patent Grant
Method and apparatus for measuring the thicknesses of layers of a m...
Patent number
5,523,840
Issue date
Jun 4, 1996
Mitsubishi Denki Kabushiki Kaisha
Seiji Nishizawa
G01 - MEASURING TESTING
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Patent Grant
Apparatus for preparing sample solution for infrared spectrophotome...
Patent number
4,841,145
Issue date
Jun 20, 1989
Nihon Bunko Kogyo Kabushiki Kaisha
Akio Wada
G01 - MEASURING TESTING