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Seiji Sato

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  • Nagano-shi, Nagano, JP
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    EMBEDDED PRINTED CIRCUIT BOARD
    • Publication number 20230199967
    • Publication date Jun 22, 2023
    • Shinko Electric Industries Co., Ltd.
    • Seiji Sato
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20200185326
    • Publication date Jun 11, 2020
    • Shinko Electric Industries Co., Ltd.
    • Seiji Sato
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE WITH ENCAPSULATING RESIN
    • Publication number 20190326189
    • Publication date Oct 24, 2019
    • Shinko Electric Industries Co., Ltd.
    • Seiji Sato
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
    • Publication number 20100295174
    • Publication date Nov 25, 2010
    • Shinko Electric Industries Co., Ltd.
    • Takashi Ozawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20100252938
    • Publication date Oct 7, 2010
    • Shinko Electric Industries Co., Ltd.
    • Takashi OZAWA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FLIP-CHIP MOUNTING SUBSTRATE AND FLIP-CHIP MOUNTING METHOD
    • Publication number 20090250812
    • Publication date Oct 8, 2009
    • Shinko Electric Industries Co., Ltd.
    • Yasushi Araki
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME, AND SEMICOND...
    • Publication number 20090102062
    • Publication date Apr 23, 2009
    • Shinko Electric Industries Co., Ltd.
    • Seiji Sato
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    • Publication number 20080188040
    • Publication date Aug 7, 2008
    • Shinko Electric Industries Co., Ltd.
    • Takashi Ozawa
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    FLIP-CHIP MOUNTING SUBSTRATE
    • Publication number 20080142993
    • Publication date Jun 19, 2008
    • Shinko Electric Industries Co., Ltd.
    • Takashi Ozawa
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    FLIP-CHIP MOUNTING SUBSTRATE AND FLIP-CHIP MOUNTING METHOD
    • Publication number 20070145553
    • Publication date Jun 28, 2007
    • Shinko Electric Industries Co., Ltd.
    • Yasushi Araki
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MOUNTING SUBSTRATE AND SEMICONDUCTOR DEVICE
    • Publication number 20070108628
    • Publication date May 17, 2007
    • Shinko Electric Industries Co., Ltd.
    • Takashi Ozawa
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...