Seiji Takemura

Person

Itami, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of making IC card
- Patent number 5,735,040
- Issue date Apr 7, 1998
- Mitsubishi Denki Kabushiki Kaisha
- Katsunori Ochi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Thin IC card
- Patent number 5,677,568
- Issue date Oct 14, 1997
- Mitsubishi Denki Kabushiki Kaisha
- Katsunori Ochi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor pressure sensor for use at high temperature and press...
- Patent number 5,333,505
- Issue date Aug 2, 1994
- Mitsubishi Denki Kabushiki Kaisha
- Yoshiharu Takahashi
- G01 - MEASURING TESTING
Information Patent Grant
Packaged semiconductor device
- Patent number 5,324,985
- Issue date Jun 28, 1994
- Mitsubishi Denki Kabushiki Kaisha
- Tomomi Hamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 5,251,107
- Issue date Oct 5, 1993
- Mitsubishi Denki Kabushiki Kaisha
- Seiji Takemura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor pressure sensor device with t...
- Patent number 5,225,373
- Issue date Jul 6, 1993
- Mitsubishi Denki Kabushiki Kaisha
- Yoshiharu Takahashi
- G01 - MEASURING TESTING
Information Patent Grant
Carrier tape
- Patent number 5,196,917
- Issue date Mar 23, 1993
- Mitsubishi Denki Kabushiki Kaisha
- Tetsuya Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid sealed semiconductor device and method of assembling the same
- Patent number 5,187,565
- Issue date Feb 16, 1993
- Mitsubishi Denki Kabushiki Kaisha
- Masataka Kawai
- G01 - MEASURING TESTING
Information Patent Grant
Manufacturing method for semiconductor device
- Patent number 5,166,099
- Issue date Nov 24, 1992
- Mitsubishi Denki Kabushiki Kaisha
- Tetsuya Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor acceleration sensor
- Patent number 5,157,472
- Issue date Oct 20, 1992
- Mitsubishi Denki Kabushiki Kaisha
- Seiji Takemura
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor pressure sensor device with two semiconductor pressur...
- Patent number 5,126,813
- Issue date Jun 30, 1992
- Mitsubishi Denki Kabushiki Kaisha
- Yoshiharu Takahashi
- G01 - MEASURING TESTING

Seiji Takemura

Person

Patents Grantslast 30 patents

Method of making IC card

Thin IC card

Semiconductor pressure sensor for use at high temperature and press...

Packaged semiconductor device

Semiconductor package

Method of manufacturing semiconductor pressure sensor device with t...

Carrier tape

Liquid sealed semiconductor device and method of assembling the same

Manufacturing method for semiconductor device

Semiconductor acceleration sensor

Semiconductor pressure sensor device with two semiconductor pressur...