Seiji TOKII

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Mounting structure and method for supplying reinforcing resin material
- Patent number 9,955,604
- Issue date Apr 24, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Seiji Tokii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting method and mounting structure for semiconductor package co...
- Patent number 9,331,047
- Issue date May 3, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Naomichi Ohashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component package, electronic component mounted apparatu...
- Patent number 8,233,288
- Issue date Jul 31, 2012
- Panasonic Corporation
- Seiji Tokii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and mounting structure for surface mounted de...
- Patent number 8,218,333
- Issue date Jul 10, 2012
- Panasonic Corporation
- Masato Udaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and mounting structure for surface mounted de...
- Patent number 8,116,094
- Issue date Feb 14, 2012
- Panasonic Corporation
- Masato Udaka

Patents Applicationslast 30 patents

Information Patent Application
MOUNTING STRUCTURE AND METHOD FOR SUPPLYING REINFORCING RESIN MATERIAL
- Publication number 20150181740
- Publication date Jun 25, 2015
- Panasonic Intellectual Property Management Co., Ltd.
- Seiji TOKII
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING METHOD AND MOUNTING STRUCTURE FOR SEMICONDUCTOR PACKAGE CO...
- Publication number 20140120663
- Publication date May 1, 2014
- PANASONIC CORPORATION
- Naomichi Ohashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING METHOD AND MOUNTING STRUCTURE FOR SEMICONDUCTOR PACKAGE CO...
- Publication number 20110108997
- Publication date May 12, 2011
- PANASONIC CORPORATION
- Naomichi Ohashi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electronic Device and Manufacturing Method for Electronic Device
- Publication number 20100101845
- Publication date Apr 29, 2010
- Arata Kishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MOUNTING STRUCTURE FOR SURFACE MOUNTED DE...
- Publication number 20090229879
- Publication date Sep 17, 2009
- PANASONIC CORPORATION
- Masato Udaka
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MOUNTING STRUCTURE FOR SURFACE MOUNTED DEVICE AND METHOD OF FIRMLY...
- Publication number 20090227136
- Publication date Sep 10, 2009
- PANASONIC CORPORATION
- Seiji TOKII
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT PACKAGE, ELECTRONIC COMPONENT MOUNTED APPARATU...
- Publication number 20080266825
- Publication date Oct 30, 2008
- Matsushita Electric Industrial Co., Ltd.
- Seiji TOKII
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Seiji TOKII

Person

Patents Grantslast 30 patents

Mounting structure and method for supplying reinforcing resin material

Mounting method and mounting structure for semiconductor package co...

Electronic component package, electronic component mounted apparatu...

Printed circuit board and mounting structure for surface mounted de...

Printed circuit board and mounting structure for surface mounted de...

Patents Applicationslast 30 patents

MOUNTING STRUCTURE AND METHOD FOR SUPPLYING REINFORCING RESIN MATERIAL

MOUNTING METHOD AND MOUNTING STRUCTURE FOR SEMICONDUCTOR PACKAGE CO...

MOUNTING METHOD AND MOUNTING STRUCTURE FOR SEMICONDUCTOR PACKAGE CO...

Electronic Device and Manufacturing Method for Electronic Device

PRINTED CIRCUIT BOARD AND MOUNTING STRUCTURE FOR SURFACE MOUNTED DE...

MOUNTING STRUCTURE FOR SURFACE MOUNTED DEVICE AND METHOD OF FIRMLY...

ELECTRONIC COMPONENT PACKAGE, ELECTRONIC COMPONENT MOUNTED APPARATU...