Seiki Harada

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Hachioji, JA

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Patents Grantslast 30 patents

Information Patent Grant
Aluminum oxide layer bonding polymer resin layer to semiconductor d...
- Patent number 4,040,083
- Issue date Aug 2, 1977
- Hitachi, Ltd.
- Atsushi Saiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discrete semiconductor device having polymer resin as insulator and...
- Patent number 4,017,886
- Issue date Apr 12, 1977
- Hitachi, Ltd.
- Masami Tomono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolating protective film for semiconductor devices and method for...
- Patent number 4,001,870
- Issue date Jan 4, 1977
- Hitachi, Ltd.
- Atsushi Saiki
- H01 - BASIC ELECTRIC ELEMENTS