Seil OH

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Suwon-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Through-silicon via (TSV) key for overlay measurement, and semicond...
- Patent number 11,749,614
- Issue date Sep 5, 2023
- Samsung Electronics Co., Ltd.
- Yongyeop Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20240304661
- Publication date Sep 12, 2024
- Samsung Electronics Co., Ltd.
- Gina Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SILICON VIA (TSV) KEY FOR OVERLAY MEASUREMENT, AND SEMICOND...
- Publication number 20220139840
- Publication date May 5, 2022
- Samsung Electronics Co., Ltd.
- Yongyeop KIM
- H01 - BASIC ELECTRIC ELEMENTS