Seisei Oyamada

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Thin-film capacitor structure and semiconductor device including th...
- Patent number 10,833,028
- Issue date Nov 10, 2020
- Noda Screen Co., Ltd.
- Seisei Oyamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intermediate connector, semiconductor device including intermediate...
- Patent number 10,483,182
- Issue date Nov 19, 2019
- Noda Screen Co., Ltd.
- Seisei Oyamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layered circuit board and semiconductor device
- Patent number 10,149,379
- Issue date Dec 4, 2018
- Noda Screen Co., Ltd.
- Seisei Oyamada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 9,761,544
- Issue date Sep 12, 2017
- Noda Screen Co., Ltd.
- Seisei Oyamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 9,627,354
- Issue date Apr 18, 2017
- Noda Screen Co., Ltd.
- Seisei Oyamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an inner power supply plate structure
- Patent number 9,431,337
- Issue date Aug 30, 2016
- Noda Screen Co., Ltd.
- Seisei Oyamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,153,549
- Issue date Oct 6, 2015
- Noda Screen Co., Ltd.
- Seisei Oyamada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and bypass capacitor module
- Patent number 8,299,518
- Issue date Oct 30, 2012
- Liquid Design Systems Inc.
- Seisei Oyamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring structure of a substrate
- Patent number 8,089,005
- Issue date Jan 3, 2012
- Liquid Design Systems Inc.
- Seisei Oyamada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
THIN-FILM CAPACITOR STRUCTURE AND SEMICONDUCTOR DEVICE INCLUDING TH...
- Publication number 20200126934
- Publication date Apr 23, 2020
- Noda Screen Co., Ltd.
- Seisei OYAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERMEDIATE CONNECTOR, SEMICONDUCTOR DEVICE INCLUDING INTERMEDIATE...
- Publication number 20190131202
- Publication date May 2, 2019
- Noda Screen Co., Ltd.
- Seisei OYAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170263577
- Publication date Sep 14, 2017
- Noda Screen Co., Ltd.
- Seisei OYAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20170092615
- Publication date Mar 30, 2017
- Noda Screen Co., Ltd.
- Seisei OYAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYERED CIRCUIT BOARD AND SEMICONDUCTOR DEVICE
- Publication number 20160262260
- Publication date Sep 8, 2016
- Noda Screen Co., Ltd.
- Seisei OYAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160204058
- Publication date Jul 14, 2016
- Noda Screen Co., Ltd.
- Seisei OYAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140070368
- Publication date Mar 13, 2014
- Noda Screen Co., Ltd.
- Seisei Oyamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and bypass capacitor module
- Publication number 20110260289
- Publication date Oct 27, 2011
- Seisei Oyamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and bypass capacitor module
- Publication number 20090230446
- Publication date Sep 17, 2009
- Technology Alliance Group, Inc.
- Seisei Oyamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power controller for a mounting substrate and a semiconductor subst...
- Publication number 20090230780
- Publication date Sep 17, 2009
- Technology Alliance Group, Inc.
- Seisei Oyamada
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Method for producing a semiconductor device and the semiconductor d...
- Publication number 20090230522
- Publication date Sep 17, 2009
- Technology Alliance Group, Inc.
- Seisei Oyamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring structure of a substrate
- Publication number 20090229866
- Publication date Sep 17, 2009
- Technology Alliance Group, Inc.
- Seisei Oyamada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Seisei Oyamada

Person

Patents Grantslast 30 patents

Thin-film capacitor structure and semiconductor device including th...

Intermediate connector, semiconductor device including intermediate...

Multi-layered circuit board and semiconductor device

Semiconductor device

Semiconductor memory device

Semiconductor device having an inner power supply plate structure

Semiconductor device

Semiconductor device and bypass capacitor module

Wiring structure of a substrate

Patents Applicationslast 30 patents

THIN-FILM CAPACITOR STRUCTURE AND SEMICONDUCTOR DEVICE INCLUDING TH...

INTERMEDIATE CONNECTOR, SEMICONDUCTOR DEVICE INCLUDING INTERMEDIATE...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MEMORY DEVICE

MULTI-LAYERED CIRCUIT BOARD AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

Semiconductor device and bypass capacitor module

Semiconductor device and bypass capacitor module

Power controller for a mounting substrate and a semiconductor subst...

Method for producing a semiconductor device and the semiconductor d...

Wiring structure of a substrate