Seisei Oyamada

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
BSC macrostructure for three-dimensional wiring and substrate havin...
- Patent number 8,243,245
- Issue date Aug 14, 2012
- Liquid Design Systems Inc.
- Seisei Oyamada
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
BSC macrostructure for three-dimensional wiring and substrate havin...
- Publication number 20090235135
- Publication date Sep 17, 2009
- Technology Alliance Group, Inc.
- Seisei Oyamada
- G01 - MEASURING TESTING