Membership
Tour
Register
Log in
Seishi Oida
Follow
Person
Kyoto-shi, JP
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor device
Patent number
9,018,761
Issue date
Apr 28, 2015
Panasonic Corporation
Kouji Oomori
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Lead frame having outer leads coated with a four layer plating
Patent number
8,283,759
Issue date
Oct 9, 2012
Panasonic Corporation
Seishi Oida
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device
Patent number
6,917,118
Issue date
Jul 12, 2005
Matsushita Electric Industrial Co., Ltd.
Kouji Omori
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device, semiconductor packaging method, assembly and...
Patent number
6,853,077
Issue date
Feb 8, 2005
Matsushita Electric Industrial Co., Ltd.
Seishi Oida
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Resin molded semiconductor device and method for manufacturing the...
Patent number
6,291,274
Issue date
Sep 18, 2001
Matsushita Electric Industrial Co., Ltd.
Seishi Oida
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing resin-molded semiconductor device
Patent number
6,258,314
Issue date
Jul 10, 2001
Matsushita Electronics Corporation
Seishi Oida
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Method for manufacturing resin-molded semiconductor device
Patent number
6,126,885
Issue date
Oct 3, 2000
Matsushita Electronics Corporation
Seishi Oida
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20120001275
Publication date
Jan 5, 2012
PANASONIC CORPORATION
Dahe CHI
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20080185721
Publication date
Aug 7, 2008
Matsushita Electric Industrial Co., Ltd.
Kouji Oomori
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Lead frame
Publication number
20070090501
Publication date
Apr 26, 2007
Seishi Oida
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Semiconductor device
Publication number
20040089945
Publication date
May 13, 2004
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Kouji Omori
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Semiconductor device, semiconductor packaging method, assembly and...
Publication number
20030089923
Publication date
May 15, 2003
Matsushita Electric Industrial Co., Ltd.
Seishi Oida
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Resin-molded semiconductor device and method for manufacturing the...
Publication number
20010045640
Publication date
Nov 29, 2001
Seishi Oida
H01 - BASIC ELECTRIC ELEMENTS