Seiya MAGOTA

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Tokyo, JP

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Patents Applicationslast 30 patents

Information Patent Application
METAL-CLAD LAMINATE, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, A...
- Publication number 20250234458
- Publication date Jul 17, 2025
- Resonac Corporation
- Takayo KITAJIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PREPREG, LAMINATED PLATE, METAL-CLAD LAMINATED PLATE, PRINTED WIRIN...
- Publication number 20240247120
- Publication date Jul 25, 2024
- Shunsuke TONOUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR