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Seizo FUJIMOTO

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  • CHIYODA-KU, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Resin welded body and method for manufacturing the same
    • Patent number 8,852,704
    • Issue date Oct 7, 2014
    • Mitsubishi Electric Corporation
    • Seizo Fujimoto
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Grant

    Temperature sensor
    • Patent number 8,632,245
    • Issue date Jan 21, 2014
    • Mitsubishi Electric Corporation
    • Seizo Fujimoto
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Resin welded body and manufacturing method thereof
    • Patent number 8,597,755
    • Issue date Dec 3, 2013
    • Mitsubishi Electric Corporation
    • Seizo Fujimoto
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Grant

    Welding method and welding apparatus for resin member
    • Patent number 8,110,062
    • Issue date Feb 7, 2012
    • Mitsubishi Electric Corporation
    • Shinsuke Asada
    • B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
  • Information Patent Grant

    Welded resin material
    • Patent number 7,862,874
    • Issue date Jan 4, 2011
    • Mitsubishi Electric Corporation
    • Shinsuke Asada
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Grant

    Pressure sensor
    • Patent number 7,707,892
    • Issue date May 4, 2010
    • Mitsubishi Electric Corporation
    • Seizo Fujimoto
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Pressure sensor
    • Patent number 7,426,869
    • Issue date Sep 23, 2008
    • Mitsubishi Electric Corporation
    • Seizo Fujimoto
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Semiconductor pressure sensor
    • Patent number 7,219,554
    • Issue date May 22, 2007
    • Mitsubishi Denki Kabushiki Kaisha
    • Seizo Fujimoto
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Pressure sensor apparatus
    • Patent number 6,955,091
    • Issue date Oct 18, 2005
    • Seizo Fujimoto
    • G01 - MEASURING TESTING

Patents Applicationslast 30 patents

  • Information Patent Application

    RESIN WELDED BODY AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20140305581
    • Publication date Oct 16, 2014
    • Mitsubishi Electric Corporation
    • Seizo FUJIMOTO
    • B32 - LAYERED PRODUCTS
  • Information Patent Application

    RESIN WELDED BODY AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20140037914
    • Publication date Feb 6, 2014
    • Seizo FUJIMOTO
    • B32 - LAYERED PRODUCTS
  • Information Patent Application

    TEMPERATURE SENSOR
    • Publication number 20120294330
    • Publication date Nov 22, 2012
    • Mitsubishi Electric Corporation
    • Seizo FUJIMOTO
    • G01 - MEASURING TESTING
  • Information Patent Application

    WELDING METHOD AND WELDING APPARATUS FOR RESIN MEMBER
    • Publication number 20090126869
    • Publication date May 21, 2009
    • Mitsubishi Electric Corporation
    • Shinsuke ASADA
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Application

    PRESSURE SENSOR
    • Publication number 20080302189
    • Publication date Dec 11, 2008
    • MITSUBISHI ELECTRIC CORPORATION
    • Seizo Fujimoto
    • G01 - MEASURING TESTING
  • Information Patent Application

    Resin welded body and manufacturing method thereof
    • Publication number 20080261065
    • Publication date Oct 23, 2008
    • MITSUBISHI ELECTRIC CORPORATION
    • Seizo Fujimoto
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Application

    METHOD FOR PRODUCING WELDED RESIN MATERIAL AND WELDED RESIN MATERIAL
    • Publication number 20080254242
    • Publication date Oct 16, 2008
    • Mitsubishi Electric Corporation
    • Shinsuke ASADA
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Application

    Pressure sensor
    • Publication number 20070272028
    • Publication date Nov 29, 2007
    • MITSUBISHI ELECTRIC CORPORATION
    • Seizo Fujimoto
    • G01 - MEASURING TESTING
  • Information Patent Application

    Semiconductor pressure sensor
    • Publication number 20060278012
    • Publication date Dec 14, 2006
    • Mitsubishi Denki Kabushiki Kaisha
    • Seizo Fujimoto
    • G01 - MEASURING TESTING
  • Information Patent Application

    Pressure sensor apparatus
    • Publication number 20040231426
    • Publication date Nov 25, 2004
    • Mitsubishi Denki Kabushiki Kaisha
    • Seizo Fujimoto
    • G01 - MEASURING TESTING