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Sek Hoi Chong
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Melaka, MY
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Patents Grants
last 30 patents
Information
Patent Grant
Methods and systems of packaging integrated circuits
Patent number
8,030,138
Issue date
Oct 4, 2011
National Semiconductor Corporation
You Chye How
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Panel level methods and systems for packaging integrated circuits w...
Patent number
7,998,791
Issue date
Aug 16, 2011
National Semiconductor Corporation
Sek Hoi Chong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadframe panel for power packages
Patent number
7,763,958
Issue date
Jul 27, 2010
National Semiconductor Corporation
Peng Soon Lim
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Optical leadless leadframe package
Patent number
7,582,954
Issue date
Sep 1, 2009
National Semiconductor Corporation
Peng Soon Lim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Spring-based probe pin that allows kelvin testing
Patent number
7,271,606
Issue date
Sep 18, 2007
National Semiconductor Corporation
Tze Kang Tang
G01 - MEASURING TESTING
Information
Patent Grant
Bilevel probe
Patent number
7,102,371
Issue date
Sep 5, 2006
National Semiconductor Corporation
Tze Kang Tang
G01 - MEASURING TESTING
Patents Applications
last 30 patents
Information
Patent Application
OPTICAL LEADLESS LEADFRAME PACKAGE
Publication number
20090212382
Publication date
Aug 27, 2009
National Semiconductor Corporation
Peng Soon LIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PANEL LEVEL METHODS AND SYSTEMS FOR PACKAGING INTEGRATED CIRCUITS W...
Publication number
20090194868
Publication date
Aug 6, 2009
National Semiconductor Corporation
Sek Hoi CHONG
H01 - BASIC ELECTRIC ELEMENTS