Sem-Wei Lin

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Kaohsiung, TW

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Patents Grantslast 30 patents

Information Patent Grant
Three-dimensional package and method of making the same
- Patent number 7,635,917
- Issue date Dec 22, 2009
- Advanced Semiconductor Engineering, Inc.
- Ching-Chun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die package structure
- Patent number 7,250,677
- Issue date Jul 31, 2007
- Advanced Semiconductor Engineering, Inc.
- Sem-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THREE-DIMENSIONAL PACKAGE AND METHOD OF MAKING THE SAME
- Publication number 20080142957
- Publication date Jun 19, 2008
- Advanced Semiconductor Engineering, Inc.
- Ching-Chun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package module having a stacking platform
- Publication number 20070029668
- Publication date Feb 8, 2007
- ADVANCED SEMICONDUCTOR ENGINEERING INC.
- Sem-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS