Sen-Kuei HSU

Person

Kaohsiung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Package structure
- Patent number 12,266,648
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method of package structure the...
- Patent number 12,051,666
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a semiconductor die and a plurality...
- Patent number 12,021,024
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,014,992
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,942,442
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive traces in semiconductor devices and methods of forming same
- Patent number 11,894,299
- Issue date Feb 6, 2024
- TAIWAN SEMICONDUCTOR LTD
- Chao-Wen Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test circuit and method
- Patent number 11,852,672
- Issue date Dec 26, 2023
- TAIWAN SEMICONDUCTORMANUFACTURING COMPANY LIMITED
- Mill-Jer Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,824,054
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless charging devices having wireless charging coils and method...
- Patent number 11,631,993
- Issue date Apr 18, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,532,576
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,508,666
- Issue date Nov 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test circuit and method
- Patent number 11,467,203
- Issue date Oct 11, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mill-Jer Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, package structure including a heat dissipatio...
- Patent number 11,444,023
- Issue date Sep 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having thermal through vias (TTV)
- Patent number 11,373,922
- Issue date Jun 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method of package structure the...
- Patent number 11,355,466
- Issue date Jun 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having channels formed between through-insula...
- Patent number 11,322,453
- Issue date May 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,296,067
- Issue date Apr 5, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices for high-density probing techniques and method of implement...
- Patent number 11,249,112
- Issue date Feb 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mill-Jer Wang
- G01 - MEASURING TESTING
Information Patent Grant
Conductive traces in semiconductor devices and methods of forming same
- Patent number 10,937,734
- Issue date Mar 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Wen Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,872,842
- Issue date Dec 22, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, semiconductor device and method for packagin...
- Patent number 10,867,882
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 10,840,197
- Issue date Nov 17, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, package structure and method of fabricating t...
- Patent number 10,818,588
- Issue date Oct 27, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 10,818,651
- Issue date Oct 27, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having thermal through vias (TTV)
- Patent number 10,748,831
- Issue date Aug 18, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test circuit and method
- Patent number 10,725,090
- Issue date Jul 28, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mill-Jer Wang
- G01 - MEASURING TESTING
Information Patent Grant
Wireless charging devices having wireless charging coils and method...
- Patent number 10,720,788
- Issue date Jul 21, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Devices for high-density probing techniques and method of implement...
- Patent number 10,718,790
- Issue date Jul 21, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mill-Jer Wang
- G01 - MEASURING TESTING
Information Patent Grant
Packaging of semiconductor device with antenna and heat spreader
- Patent number 10,490,479
- Issue date Nov 26, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices for high-density probing techniques and method of implement...
- Patent number 10,274,518
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mill-Jer Wang
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF PACKAGE STRUCTURE AND PACKAGE STRUCTURE THE...
- Publication number 20240339427
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING PACKAGE STRUCTURE
- Publication number 20240312904
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240304561
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240194619
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Traces in Semiconductor Devices and Methods of Forming Same
- Publication number 20240136280
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Wen Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20230378152
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230061943
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST CIRCUIT AND METHOD
- Publication number 20220357389
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Mill-Jer WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, PACKAGE STRUCTURE AND METHOD OF FABRICATING T...
- Publication number 20220359382
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR PACKAGES HAVING THERMAL THROUGH VIA...
- Publication number 20220285241
- Publication date Sep 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD OF PACKAGE STRUCTURE THE...
- Publication number 20220262758
- Publication date Aug 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20220216194
- Publication date Jul 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210407914
- Publication date Dec 30, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210249372
- Publication date Aug 12, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD OF PACKAGE STRUCTURE THE...
- Publication number 20210242159
- Publication date Aug 5, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Traces in Semiconductor Devices and Methods of Forming Same
- Publication number 20210183760
- Publication date Jun 17, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Wen Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210159185
- Publication date May 27, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, PACKAGE STRUCTURE AND METHOD OF FABRICATING T...
- Publication number 20210043564
- Publication date Feb 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210043590
- Publication date Feb 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20200411499
- Publication date Dec 31, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING THERMAL THROUGH VIAS (TTV)
- Publication number 20200373219
- Publication date Nov 26, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST CIRCUIT AND METHOD
- Publication number 20200355737
- Publication date Nov 12, 2020
- Taiwan Semiconductor Manufacturing Company Limited
- Mill-Jer Wang
- G01 - MEASURING TESTING
Information Patent Application
Wireless Charging Devices Having Wireless Charging Coils and Method...
- Publication number 20200350782
- Publication date Nov 5, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
DEVICES FOR HIGH-DENSITY PROBING TECHNIQUES AND METHOD OF IMPLEMENT...
- Publication number 20200348341
- Publication date Nov 5, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Mill-Jer WANG
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20200273773
- Publication date Aug 27, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, PACKAGE STRUCTURE AND METHOD OF FABRICATING T...
- Publication number 20200251414
- Publication date Aug 6, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20200243497
- Publication date Jul 30, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200135670
- Publication date Apr 30, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGIN...
- Publication number 20200091031
- Publication date Mar 19, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20190371694
- Publication date Dec 5, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Sen-Kuei HSU

Person

Patents Grantslast 30 patents

Package structure

Package structure and manufacturing method of package structure the...

Semiconductor device including a semiconductor die and a plurality...

Semiconductor package

Package structure and manufacturing method thereof

Conductive traces in semiconductor devices and methods of forming same

Test circuit and method

Package structure

Wireless charging devices having wireless charging coils and method...

Semiconductor package and manufacturing method thereof

Semiconductor package

Test circuit and method

Semiconductor device, package structure including a heat dissipatio...

Semiconductor packages having thermal through vias (TTV)

Package structure and manufacturing method of package structure the...

Semiconductor package having channels formed between through-insula...

Package structure

Devices for high-density probing techniques and method of implement...

Conductive traces in semiconductor devices and methods of forming same

Semiconductor device and manufacturing method thereof

Semiconductor package, semiconductor device and method for packagin...

Package structure and manufacturing method thereof

Semiconductor device, package structure and method of fabricating t...

Package structure

Semiconductor packages having thermal through vias (TTV)

Test circuit and method

Wireless charging devices having wireless charging coils and method...

Devices for high-density probing techniques and method of implement...

Packaging of semiconductor device with antenna and heat spreader

Devices for high-density probing techniques and method of implement...

Patents Applicationslast 30 patents

MANUFACTURING METHOD OF PACKAGE STRUCTURE AND PACKAGE STRUCTURE THE...

METHOD OF FABRICATING PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Conductive Traces in Semiconductor Devices and Methods of Forming Same

PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE

TEST CIRCUIT AND METHOD

SEMICONDUCTOR DEVICE, PACKAGE STRUCTURE AND METHOD OF FABRICATING T...

METHOD OF FORMING SEMICONDUCTOR PACKAGES HAVING THERMAL THROUGH VIA...

PACKAGE STRUCTURE AND MANUFACTURING METHOD OF PACKAGE STRUCTURE THE...

PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD OF PACKAGE STRUCTURE THE...

Conductive Traces in Semiconductor Devices and Methods of Forming Same

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE, PACKAGE STRUCTURE AND METHOD OF FABRICATING T...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGES HAVING THERMAL THROUGH VIAS (TTV)

TEST CIRCUIT AND METHOD

Wireless Charging Devices Having Wireless Charging Coils and Method...

DEVICES FOR HIGH-DENSITY PROBING TECHNIQUES AND METHOD OF IMPLEMENT...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE, PACKAGE STRUCTURE AND METHOD OF FABRICATING T...

PACKAGE STRUCTURE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGIN...

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME