Sen Mao

Person

  • New Taipei, TW

Patents Grantslast 30 patents

  • Information Patent Grant

    Integrated packaging structure

    • Patent number 10,090,298
    • Issue date Oct 2, 2018
    • Taiwan Semiconductor Co., Ltd.
    • Chien-Chung Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Common-source packaging structure

    • Patent number 10,056,355
    • Issue date Aug 21, 2018
    • Taiwan Semiconductor Co., Ltd.
    • Chien-Chung Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Common-source packaging structure

    • Patent number 9,997,500
    • Issue date Jun 12, 2018
    • Taiwan Semiconductor Co., Ltd.
    • Chien-Chung Chen
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents