Seng Hooi Ong

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Simpang Ampat, MY

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Patents Grantslast 30 patents

Information Patent Grant
Electronic package with high density interconnect and associated me...
- Patent number 6,664,483
- Issue date Dec 16, 2003
- Intel Corporation
- Tee Onn Chong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stitched plane structure for package power delivery and dual refere...
- Patent number 6,429,051
- Issue date Aug 6, 2002
- Intel Corporation
- Dustin Wood
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Electronic package with high density interconnect and associated me...
- Publication number 20020172026
- Publication date Nov 21, 2002
- Intel Corporation
- Tee Onn Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stitched plane structure and process for package power delivery and...
- Publication number 20020117744
- Publication date Aug 29, 2002
- Dustin Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STITCHED PLANE STRUCTURE FOR PACKAGE POWER DELIVERY AND DUAL REFERE...
- Publication number 20020115238
- Publication date Aug 22, 2002
- Dustin Wood
- H01 - BASIC ELECTRIC ELEMENTS