Seng Kiong Teng

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Shah Alam, MY

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Patents Grantslast 30 patents

Information Patent Grant
Power bar design for lead frame-based packages
- Patent number 9,177,834
- Issue date Nov 3, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coated lead frame bond finger
- Patent number 9,129,951
- Issue date Sep 8, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Seng Kiong Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid lead frame and ball grid array package
- Patent number 8,987,881
- Issue date Mar 24, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Seng Kiong Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame with power bar for semiconductor device
- Patent number 8,933,547
- Issue date Jan 13, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Jia Lin Yap
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER BAR DESIGN FOR LEAD FRAME-BASED PACKAGES
- Publication number 20150235924
- Publication date Aug 20, 2015
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL CORNER TOP GATE MOLDING
- Publication number 20150118802
- Publication date Apr 30, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Boon Yew Low
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
COATED LEAD FRAME BOND FINGER
- Publication number 20150108623
- Publication date Apr 23, 2015
- Seng Kiong Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID LEAD FRAME AND BALL GRID ARRAY PACKAGE
- Publication number 20150014834
- Publication date Jan 15, 2015
- Seng Kiong Teng
- H01 - BASIC ELECTRIC ELEMENTS