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Sengsooi Lim
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San Jose, CA, US
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last 30 patents
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Patent Grant
Tape design to reduce warpage
Patent number
6,486,002
Issue date
Nov 26, 2002
LSI Logic Corporation
Qwai H. Low
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process for manufacturing a semiconductor device having a stiffener...
Patent number
6,020,221
Issue date
Feb 1, 2000
LSI Logic Corporation
Sengsooi Lim
H01 - BASIC ELECTRIC ELEMENTS