Seok Kim (Annie) Tay

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Semi-flex component carrier with dielectric material surrounding an...
- Patent number 12,127,338
- Issue date Oct 22, 2024
- AT&S(China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semi-flex component carrier with dielectric material having high el...
- Patent number 12,058,810
- Issue date Aug 6, 2024
- AT&SAustria Technologie & Systemtechnik AG
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with well-defined outline sidewall cut by short l...
- Patent number 12,048,101
- Issue date Jul 23, 2024
- AT&S(China) Co. Ltd.
- Seok Kim Tay
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with low-solvent fiber-free dielectric layer
- Patent number 12,041,730
- Issue date Jul 16, 2024
- AT&SAustria Technologie & Systemtechnik AG
- Seok Kim Tay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier having component covered with ultra-thin transiti...
- Patent number 11,963,310
- Issue date Apr 16, 2024
- AT&S(China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
User interface for judgment concerning quality classification of di...
- Patent number 11,935,221
- Issue date Mar 19, 2024
- AT&S (Chongqing) Company Limited
- Amin Nickkholgh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Traceability of subsequent layer structure manufacturing of main bo...
- Patent number 11,937,369
- Issue date Mar 19, 2024
- AT&S(China) Co. Ltd.
- Seok Kim Tay
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Component carrier with through hole filled with extra plating struc...
- Patent number 11,778,754
- Issue date Oct 3, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Robin Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with low shrinkage dielectric material
- Patent number 11,688,668
- Issue date Jun 27, 2023
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement with central carrier and two opposing layer stacks, com...
- Patent number 11,670,613
- Issue date Jun 6, 2023
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with embedded component exposed by blind hole
- Patent number 11,617,259
- Issue date Mar 28, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semi-flexible component carrier with stepped layer structure
- Patent number 11,589,462
- Issue date Feb 21, 2023
- AT&S(China) Co. Ltd.
- Nick Xin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with electrically reliable bridge with sufficient...
- Patent number 11,483,927
- Issue date Oct 25, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Ismadi Bin Ismail
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with embedded component and horizontally elongate...
- Patent number 11,470,714
- Issue date Oct 11, 2022
- AT&S (China) Co. Ltd.
- Gin Feng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with electrically conductive layer structures hav...
- Patent number 11,452,212
- Issue date Sep 20, 2022
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier and method of manufacturing a component carrier
- Patent number 11,445,601
- Issue date Sep 13, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Mikael Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with embedded large die
- Patent number 11,330,706
- Issue date May 10, 2022
- AT&S (China) Co. Ltd.
- Seok Kim Tay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semi-flex component carrier with dielectric material surrounding an...
- Patent number 11,291,119
- Issue date Mar 29, 2022
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with different surface finishes and method for ma...
- Patent number 11,284,511
- Issue date Mar 22, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Giordano Di Gregorio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semi-flex component carrier with dielectric material having high el...
- Patent number 11,284,508
- Issue date Mar 22, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with through hole extending through multiple diel...
- Patent number 11,160,165
- Issue date Oct 26, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package comprising a decoupling layer structure
- Patent number 11,083,081
- Issue date Aug 3, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing holes in component carrier material
- Patent number 11,039,535
- Issue date Jun 15, 2021
- AT&S (China) Co. Ltd.
- Seok Kim Tay
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with electrically reliable bridge with sufficient...
- Patent number 10,966,318
- Issue date Mar 30, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Ismadi Bin Ismail
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Electronic Package Comprising a Decoupling Layer Structure
- Publication number 20240030095
- Publication date Jan 25, 2024
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Mikael Andreas Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Asymmetric Build-Up And Methods for Determin...
- Publication number 20230217589
- Publication date Jul 6, 2023
- AT&S (China) Co. Ltd.
- Diego LORENZONI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier
- Publication number 20230180383
- Publication date Jun 8, 2023
- AT&S (China) Co. Ltd.
- Nick Xin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of Manufacturing a Component Carrier and a Component Carrier
- Publication number 20230171897
- Publication date Jun 1, 2023
- AT&S (China) Co. Ltd.
- Ismadi Bin ISMAIL
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Component Carrier With Different Stack Heights and Vertical Opening...
- Publication number 20230043085
- Publication date Feb 9, 2023
- AT&S (China) Co. Ltd.
- Seok Kim TAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semi-Flex Component Carrier With Dielectric Material Surrounding an...
- Publication number 20220256686
- Publication date Aug 11, 2022
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semi-Flex Component Carrier With Dielectric Material Having High El...
- Publication number 20220159828
- Publication date May 19, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Low-Solvent Fiber-Free Dielectric Layer
- Publication number 20220078923
- Publication date Mar 10, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Seok Kim Tay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Well-Defined Outline Sidewall Cut by Short L...
- Publication number 20220061162
- Publication date Feb 24, 2022
- AT&S (China) Co. Ltd.
- Seok Kim Tay
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semi-Flexible Component Carrier With Stepped Layer Structure
- Publication number 20220039259
- Publication date Feb 3, 2022
- AT&S (China) Co. Ltd.
- Nick Xin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Embedded Component Exposed by Blind Hole
- Publication number 20210243889
- Publication date Aug 5, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier Having Component Covered With Ultra-Thin Transiti...
- Publication number 20210227702
- Publication date Jul 22, 2021
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Arrangement With Central Carrier And Two Opposing Layer Stacks, Com...
- Publication number 20210202427
- Publication date Jul 1, 2021
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Low Shrinkage Dielectric Material
- Publication number 20210202355
- Publication date Jul 1, 2021
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier and Method of Manufacturing a Component Carrier
- Publication number 20210204399
- Publication date Jul 1, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Mikael Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Electrically Reliable Bridge With Sufficient...
- Publication number 20210161012
- Publication date May 27, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Ismadi Bin Ismail
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
User Interface for Judgment Concerning Quality Classification of Di...
- Publication number 20210158508
- Publication date May 27, 2021
- AT&S (Chongqing) Company Limited
- Amin Nickkholgh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
AI-based Automatic Judgment Unit for Quality Classification of Semi...
- Publication number 20210158499
- Publication date May 27, 2021
- AT&S (Chongqing) Company Limited
- Seok Kim Tay
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COMPONENT CARRIER WITH EMBEDDED COMPONENT AND HORIZONTALLY ELONGATE...
- Publication number 20210127478
- Publication date Apr 29, 2021
- AT&S (China) Co. Ltd.
- Gin Feng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Electrically Conductive Layer Structures Hav...
- Publication number 20210127496
- Publication date Apr 29, 2021
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Through Hole Extending Through Multiple Diel...
- Publication number 20210100095
- Publication date Apr 1, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Traceability of Subsequent Layer Structure Manufacturing of Main Bo...
- Publication number 20210084752
- Publication date Mar 18, 2021
- AT&S (China) Co. Ltd.
- Seok Kim Tay
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semi-Flex Component Carrier With Dielectric Material Having High El...
- Publication number 20210045235
- Publication date Feb 11, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semi-Flex Component Carrier With Dielectric Material Surrounding an...
- Publication number 20210045249
- Publication date Feb 11, 2021
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing Holes In Component Carrier Material
- Publication number 20200253051
- Publication date Aug 6, 2020
- AT&S (China) Co. Ltd.
- Seok Kim Tay
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Through Hole Filled With Extra Plating Struc...
- Publication number 20200253062
- Publication date Aug 6, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Robin Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Electrically Reliable Bridge With Sufficient...
- Publication number 20200253053
- Publication date Aug 6, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Ismadi Bin Ismail
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of Manufacturing a Component Carrier Using a Separation Comp...
- Publication number 20200163223
- Publication date May 21, 2020
- AT&S (Chongqing) Company Limited
- Jeesoo Mok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Package Comprising a Decoupling Layer Structure
- Publication number 20200163206
- Publication date May 21, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Embedded Large Die
- Publication number 20200163205
- Publication date May 21, 2020
- AT&S (China) Co. Ltd.
- Seok Kim Tay
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Seok Kim (Annie) Tay

Person

Patents Grantslast 30 patents

Semi-flex component carrier with dielectric material surrounding an...

Semi-flex component carrier with dielectric material having high el...

Component carrier with well-defined outline sidewall cut by short l...

Component carrier with low-solvent fiber-free dielectric layer

Component carrier having component covered with ultra-thin transiti...

User interface for judgment concerning quality classification of di...

Traceability of subsequent layer structure manufacturing of main bo...

Component carrier with through hole filled with extra plating struc...

Component carrier with low shrinkage dielectric material

Arrangement with central carrier and two opposing layer stacks, com...

Component carrier with embedded component exposed by blind hole

Semi-flexible component carrier with stepped layer structure

Component carrier with electrically reliable bridge with sufficient...

Component carrier with embedded component and horizontally elongate...

Component carrier with electrically conductive layer structures hav...

Component carrier and method of manufacturing a component carrier

Component carrier with embedded large die

Semi-flex component carrier with dielectric material surrounding an...

Component carrier with different surface finishes and method for ma...

Semi-flex component carrier with dielectric material having high el...

Component carrier with through hole extending through multiple diel...

Electronic package comprising a decoupling layer structure

Manufacturing holes in component carrier material

Component carrier with electrically reliable bridge with sufficient...

Patents Applicationslast 30 patents

Electronic Package Comprising a Decoupling Layer Structure

Component Carrier With Asymmetric Build-Up And Methods for Determin...

Component Carrier

Method of Manufacturing a Component Carrier and a Component Carrier

Component Carrier With Different Stack Heights and Vertical Opening...

Semi-Flex Component Carrier With Dielectric Material Surrounding an...

Semi-Flex Component Carrier With Dielectric Material Having High El...

Component Carrier With Low-Solvent Fiber-Free Dielectric Layer

Component Carrier With Well-Defined Outline Sidewall Cut by Short L...

Semi-Flexible Component Carrier With Stepped Layer Structure

Component Carrier With Embedded Component Exposed by Blind Hole

Component Carrier Having Component Covered With Ultra-Thin Transiti...

Arrangement With Central Carrier And Two Opposing Layer Stacks, Com...

Component Carrier With Low Shrinkage Dielectric Material

Component Carrier and Method of Manufacturing a Component Carrier

Component Carrier With Electrically Reliable Bridge With Sufficient...

User Interface for Judgment Concerning Quality Classification of Di...

AI-based Automatic Judgment Unit for Quality Classification of Semi...

COMPONENT CARRIER WITH EMBEDDED COMPONENT AND HORIZONTALLY ELONGATE...

Component Carrier With Electrically Conductive Layer Structures Hav...

Component Carrier With Through Hole Extending Through Multiple Diel...

Traceability of Subsequent Layer Structure Manufacturing of Main Bo...

Semi-Flex Component Carrier With Dielectric Material Having High El...

Semi-Flex Component Carrier With Dielectric Material Surrounding an...

Manufacturing Holes In Component Carrier Material

Component Carrier With Through Hole Filled With Extra Plating Struc...

Component Carrier With Electrically Reliable Bridge With Sufficient...

Method of Manufacturing a Component Carrier Using a Separation Comp...

Electronic Package Comprising a Decoupling Layer Structure

Component Carrier With Embedded Large Die