Seok-Won Lee

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Seongnam-si, JP

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Patents Applicationslast 30 patents

Information Patent Application
Substrate applicable to both wire bonding and flip chip bonding, sm...
- Publication number 20070015338
- Publication date Jan 18, 2007
- SAMSUNG ELECTRONICS CO., LTD.
- Seok-Won Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR