Seokbong Kim

Person

Kyunggi-Do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic package
- Patent number 11,776,917
- Issue date Oct 3, 2023
- ADVANCED SEMICONDUCTOR ENGINEERING KOREA, INC.
- Seokbong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 10,854,556
- Issue date Dec 1, 2020
- ADVANCED SEMICONDUCTOR ENGINEERING KOREA, INC.
- Kyungsic Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 10,622,318
- Issue date Apr 14, 2020
- ADVANCED SEMICONDUCTOR ENGINEERING KOREA, INC.
- Seokbong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 10,388,586
- Issue date Aug 20, 2019
- ADVANCED SEMICONDUCTOR ENGINEERING, KOREA, INC.
- Seokbong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages with electromagnetic interference shi...
- Patent number 8,368,185
- Issue date Feb 5, 2013
- Advanced Semiconductor Engineering, Inc.
- Yuyong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and package process
- Patent number 8,178,961
- Issue date May 15, 2012
- Advanced Semiconductor Engineering, Inc.
- Ingyu Han
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device packages with electromagnetic interference shi...
- Patent number 8,030,750
- Issue date Oct 4, 2011
- Advanced Semiconductor Engineering, Inc.
- Seokbong Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER MODULE STRUCTURE WITH CLIP SUBSTRATE MEMBER
- Publication number 20250105200
- Publication date Mar 27, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seokbong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220020698
- Publication date Jan 20, 2022
- Advanced Semiconductor Engineering Korea, Inc.
- Seokbong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220013452
- Publication date Jan 13, 2022
- Advanced Semiconductor Engineering Korea, Inc.
- Seokbong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190057943
- Publication date Feb 21, 2019
- Advanced Semiconductor Engineering Korea, Inc.
- Seokbong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180315719
- Publication date Nov 1, 2018
- Advanced Semiconductor Engineering Korea, Inc.
- Seokbong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180102325
- Publication date Apr 12, 2018
- Advanced Semiconductor Engineering Korea, Inc.
- Kyungsic YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND PACKAGE PROCESS
- Publication number 20110260266
- Publication date Oct 27, 2011
- Advanced Semiconductor Engineering, Inc.
- Ingyu Han
- G01 - MEASURING TESTING
Information Patent Application
Leadframe Structure, Advanced Quad Flat No Lead Package Structure U...
- Publication number 20110163430
- Publication date Jul 7, 2011
- Advanced Semiconductor Engineering, Inc.
- Yuyong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Packages with Electromagnetic Interference Shi...
- Publication number 20110115059
- Publication date May 19, 2011
- Yuyong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES WITH ELECTROMAGNETIC INTERFERENCE SHI...
- Publication number 20110115066
- Publication date May 19, 2011
- Seokbong Kim
- H01 - BASIC ELECTRIC ELEMENTS

Seokbong Kim

Person

Patents Grantslast 30 patents

Electronic package

Semiconductor package device and method of manufacturing the same

Semiconductor package device and method of manufacturing the same

Semiconductor package device and method of manufacturing the same

Semiconductor device packages with electromagnetic interference shi...

Semiconductor package structure and package process

Semiconductor device packages with electromagnetic interference shi...

Patents Applicationslast 30 patents

POWER MODULE STRUCTURE WITH CLIP SUBSTRATE MEMBER

ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND PACKAGE PROCESS

Leadframe Structure, Advanced Quad Flat No Lead Package Structure U...

Semiconductor Device Packages with Electromagnetic Interference Shi...

SEMICONDUCTOR DEVICE PACKAGES WITH ELECTROMAGNETIC INTERFERENCE SHI...