Seokgeun Ahn

Person

Cheonan-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 11,984,426
- Issue date May 14, 2024
- Samsung Electronics Co., Ltd.
- Seokgeun Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,424,218
- Issue date Aug 23, 2022
- Samsung Electronics Co., Ltd.
- Seokgeun Ahn
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240421140
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Sanghoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240413026
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Yeongbeom KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240234369
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Seokgeun Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING HEAT DISSIPATION PILLARS
- Publication number 20240170358
- Publication date May 23, 2024
- Samsung Electronics Co., Ltd.
- Seokgeun Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240170440
- Publication date May 23, 2024
- Samsung Electronics Co., Ltd.
- Hwanyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20240136341
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Seokgeun AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240063103
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- Cheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240021577
- Publication date Jan 18, 2024
- Samsung Electronics Co., Ltd.
- Yanggyoo Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SEMICONDUCTO...
- Publication number 20240014086
- Publication date Jan 11, 2024
- Samsung Electronics Co., Ltd.
- Seokgeun Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230317678
- Publication date Oct 5, 2023
- Samsung Electronics Co., Ltd.
- Seokgeun Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220392870
- Publication date Dec 8, 2022
- Samsung Electronics Co., Ltd.
- Seokgeun Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210066245
- Publication date Mar 4, 2021
- Samsung Electronics Co., Ltd.
- Seokgeun Ahn
- H01 - BASIC ELECTRIC ELEMENTS

Seokgeun Ahn

Person

Patents Grantslast 30 patents

Semiconductor package

Semiconductor package

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES HAVING HEAT DISSIPATION PILLARS

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SEMICONDUCTO...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE