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Seokhyun Lee

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  • Hwaseong-si, KR
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20250239572
    • Publication date Jul 24, 2025
    • Samsung Electronics Co., Ltd.
    • Minjung Kim
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20250192131
    • Publication date Jun 12, 2025
    • Samsung Electronics Co., Ltd.
    • DOOHWAN LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20250192016
    • Publication date Jun 12, 2025
    • Samsung Electronics Co., Ltd.
    • HYEONJEONG HWANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20250183216
    • Publication date Jun 5, 2025
    • Samsung Electronics Co., Ltd.
    • Sanghoon Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20250167084
    • Publication date May 22, 2025
    • Dongkyu Kim
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20250167098
    • Publication date May 22, 2025
    • Samsung Electronics Co., Ltd.
    • Kyoung Lim Suk
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20250112193
    • Publication date Apr 3, 2025
    • Samsung Electronics Co., Ltd.
    • INHYUNG SONG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20250070038
    • Publication date Feb 27, 2025
    • Samsung Electronics Co., Ltd.
    • KYOUNG LIM SUK
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240355779
    • Publication date Oct 24, 2024
    • Samsung Electronics Co., Ltd.
    • Hyeonseok LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE INCLUDING UNDER BUMP METALLIZATION PAD
    • Publication number 20240347435
    • Publication date Oct 17, 2024
    • Samsung Electronics Co., Ltd.
    • Hyeonjeong Hwang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
    • Publication number 20240332268
    • Publication date Oct 3, 2024
    • Samsung Electronics Co., Ltd.
    • Kyoung Lim SUK
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    VIDEO DECODING APPARATUS AND VIDEO DECODING METHOD
    • Publication number 20240323417
    • Publication date Sep 26, 2024
    • Samsung Electronics Co., Ltd.
    • Seokhyun Lee
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240203960
    • Publication date Jun 20, 2024
    • Samsung Electronics Co., Ltd.
    • Seokhyun Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240170440
    • Publication date May 23, 2024
    • Samsung Electronics Co., Ltd.
    • Hwanyoung Choi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME
    • Publication number 20240136341
    • Publication date Apr 25, 2024
    • Samsung Electronics Co., Ltd.
    • Seokgeun AHN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
    • Publication number 20240120263
    • Publication date Apr 11, 2024
    • Samsung Electronics Co., Ltd.
    • CHEOL KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
    • Publication number 20240105689
    • Publication date Mar 28, 2024
    • Samsung Electronics Co., Ltd.
    • Seokhyun Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240071866
    • Publication date Feb 29, 2024
    • Samsung Electronics Co., Ltd.
    • CHEOL KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240063103
    • Publication date Feb 22, 2024
    • Samsung Electronics Co., Ltd.
    • Cheol Kim
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
    • Publication number 20240063236
    • Publication date Feb 22, 2024
    • Samsung Electronics Co., Ltd.
    • Seokhyun Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240063129
    • Publication date Feb 22, 2024
    • Samsung Electronics Co., Ltd.
    • Seok Geun Ahn
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240030119
    • Publication date Jan 25, 2024
    • Samsung Electronics Co., Ltd.
    • DONGKYU KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION SUBSTRATE HAVING EMBEDDED...
    • Publication number 20240021608
    • Publication date Jan 18, 2024
    • Samsung Electronics Co., Ltd.
    • KYOUNG LIM SUK
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF MANUFACTURING A STACKED SEMICONDUCTOR PACKAGE
    • Publication number 20240021563
    • Publication date Jan 18, 2024
    • Samsung Electronics Co., Ltd.
    • Seokhyun Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SEMICONDUCTO...
    • Publication number 20240014086
    • Publication date Jan 11, 2024
    • Samsung Electronics Co., Ltd.
    • Seokgeun Ahn
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
    • Publication number 20230245966
    • Publication date Aug 3, 2023
    • Samsung Electronics Co., Ltd.
    • Kyoung Lim SUK
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE DEVICE
    • Publication number 20230230965
    • Publication date Jul 20, 2023
    • Samsung Electronics Co., Ltd.
    • DONGKYU KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230215799
    • Publication date Jul 6, 2023
    • Samsung Electronics Co., Ltd.
    • Kyoung Lim Suk
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGES
    • Publication number 20230197469
    • Publication date Jun 22, 2023
    • Samsung Electronics Co., Ltd.
    • Seokhyun Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    REDISTRIBUTION SUBSTRATE, METHOD OF FABRICATING THE SAME, AND SEMIC...
    • Publication number 20230187345
    • Publication date Jun 15, 2023
    • Samsung Electronics Co., Ltd.
    • Jongyoun KIM
    • H01 - BASIC ELECTRIC ELEMENTS