Seon Ha Kang

Person

Gyunggi-do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Component package and printed circuit board for the same
- Patent number 11,638,346
- Issue date Apr 25, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seon Ha Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 11,013,114
- Issue date May 18, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seon-Ha Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,217,709
- Issue date Feb 26, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Seon Ha Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil component and method of manufacturing the same
- Patent number 9,899,136
- Issue date Feb 20, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Sa Yong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil unit for thin film inductor, manufacturing method of coil unit...
- Patent number 9,514,880
- Issue date Dec 6, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Jeong Woo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing printed circuit board
- Patent number 8,881,381
- Issue date Nov 11, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Mi Sun Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of printed circuit board and manufacturing app...
- Patent number 8,144,972
- Issue date Mar 27, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Chung Woo Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20240164028
- Publication date May 16, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Seon Ha Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20220210913
- Publication date Jun 30, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Seon Ha Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT PACKAGE AND PRINTED CIRCUIT BOARD FOR THE SAME
- Publication number 20220053631
- Publication date Feb 17, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Seon Ha Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE
- Publication number 20220005765
- Publication date Jan 6, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Moon Hee Yi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20200170110
- Publication date May 28, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Seon-Ha KANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20180102322
- Publication date Apr 12, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Seon Ha KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL COMPONENT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20170330674
- Publication date Nov 16, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Sa Yong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL UNIT FOR THIN FILM INDUCTOR, MANUFACTURING METHOD OF COIL UNIT...
- Publication number 20150048918
- Publication date Feb 19, 2015
- Samsung Electro-mechanics Co., Ltd.
- Jeong Woo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
- Publication number 20140090245
- Publication date Apr 3, 2014
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Mi Sun HWANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of fabricating printed circuit board
- Publication number 20110067233
- Publication date Mar 24, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Seon Ha Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
- Publication number 20110061231
- Publication date Mar 17, 2011
- Mi Sun HWANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board and manufacturing method thereof
- Publication number 20110061912
- Publication date Mar 17, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Myung Sam Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD, SEMICONDUCTOR DEVICE COMPRISING THE SAME, AN...
- Publication number 20100314755
- Publication date Dec 16, 2010
- Myung Sam KANG
- B32 - LAYERED PRODUCTS
Information Patent Application
Manufacturing method of printed circuit board and manufacturing app...
- Publication number 20100021045
- Publication date Jan 28, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Chung Woo Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Seon Ha Kang

Person

Patents Grantslast 30 patents

Component package and printed circuit board for the same

Printed circuit board

Fan-out semiconductor package

Coil component and method of manufacturing the same

Coil unit for thin film inductor, manufacturing method of coil unit...

Method of manufacturing printed circuit board

Manufacturing method of printed circuit board and manufacturing app...

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME

PRINTED CIRCUIT BOARD

COMPONENT PACKAGE AND PRINTED CIRCUIT BOARD FOR THE SAME

SUBSTRATE STRUCTURE

PRINTED CIRCUIT BOARD

FAN-OUT SEMICONDUCTOR PACKAGE

COIL COMPONENT AND METHOD OF MANUFACTURING THE SAME

COIL UNIT FOR THIN FILM INDUCTOR, MANUFACTURING METHOD OF COIL UNIT...

METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD

Method of fabricating printed circuit board

METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD

Printed circuit board and manufacturing method thereof

PRINTED CIRCUIT BOARD, SEMICONDUCTOR DEVICE COMPRISING THE SAME, AN...

Manufacturing method of printed circuit board and manufacturing app...