Seon Hee Moon

Person

Seoul, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Fan-out semiconductor package
- Patent number 11,515,265
- Issue date Nov 29, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seon Hee Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,075,193
- Issue date Jul 27, 2021
- Samsung Electronics Co., Ltd.
- Myung Sam Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,748,856
- Issue date Aug 18, 2020
- Samsung Electronics Co., Ltd.
- Seon Hee Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,727,212
- Issue date Jul 28, 2020
- Samsung Electronics Co., Ltd.
- Seon Hee Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip embedded board and method of manufacturing the same
- Patent number 9,345,142
- Issue date May 17, 2016
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seon Hee Moon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing interposer
- Patent number 9,196,506
- Issue date Nov 24, 2015
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hyung Jin Jeon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed circuit board
- Patent number 8,756,804
- Issue date Jun 24, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Hyung Jin Jeon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and manufacturing method thereof
- Patent number 8,624,128
- Issue date Jan 7, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Ju-Pyo Hong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a dual face package
- Patent number 8,273,660
- Issue date Sep 25, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Seung Wook Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual face package having resin insulating layer
- Patent number 8,093,705
- Issue date Jan 10, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Seung Wook Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing wafer level package including coating and r...
- Patent number 7,947,530
- Issue date May 24, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Jin Gu Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20200350262
- Publication date Nov 5, 2020
- Samsung Electronics Co., Ltd.
- Seon Hee MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200144235
- Publication date May 7, 2020
- Samsung Electronics Co., Ltd.
- Myung Sam Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20190287924
- Publication date Sep 19, 2019
- Samsung Electronics Co., Ltd.
- Seon Hee MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20190287953
- Publication date Sep 19, 2019
- Samsung Electronics Co., Ltd.
- Seon Hee MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP EMBEDDED BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150138741
- Publication date May 21, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Seon Hee Moon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERPOSER BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150083480
- Publication date Mar 26, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Seon Hee MOON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140251657
- Publication date Sep 11, 2014
- Samsung Electro-mechanics Co., Ltd.
- Hyung Jin JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING INTERPOSER
- Publication number 20130029031
- Publication date Jan 31, 2013
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hyung Jin Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120161323
- Publication date Jun 28, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yoon Su KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20120073861
- Publication date Mar 29, 2012
- Samsung Electro-Mechanics CO., LTD.
- Ju-Pyo HONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120073870
- Publication date Mar 29, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hyung Jin Jeon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120012378
- Publication date Jan 19, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hyung Jin Jeon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing wafer level package including coating resin...
- Publication number 20110201156
- Publication date Aug 18, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Jin Gu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a dual face package
- Publication number 20110129994
- Publication date Jun 2, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Seung Wook Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING WAFER LEVEL PACKAGE
- Publication number 20110097856
- Publication date Apr 28, 2011
- Hong Won KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interposer and method for manufacturing the same
- Publication number 20110061911
- Publication date Mar 17, 2011
- SAMSUNG ELECTRO-MECHANICS CO. LTD.
- Hyung Jin Jeon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing wafer level package
- Publication number 20100159646
- Publication date Jun 24, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Jin Gu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual face package and method of manufacturing the same
- Publication number 20100102426
- Publication date Apr 29, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Seung Wook Park
- H01 - BASIC ELECTRIC ELEMENTS

Seon Hee Moon

Person

Patents Grantslast 30 patents

Fan-out semiconductor package

Semiconductor package

Fan-out semiconductor package

Semiconductor package

Chip embedded board and method of manufacturing the same

Method for manufacturing interposer

Method of manufacturing printed circuit board

Printed circuit board and manufacturing method thereof

Method of manufacturing a dual face package

Dual face package having resin insulating layer

Method of manufacturing wafer level package including coating and r...

Patents Applicationslast 30 patents

FAN-OUT SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

FAN-OUT SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

CHIP EMBEDDED BOARD AND METHOD OF MANUFACTURING THE SAME

INTERPOSER BOARD AND METHOD OF MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

METHOD FOR MANUFACTURING INTERPOSER

SUBSTRATE FOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

Method of manufacturing wafer level package including coating resin...

Method of manufacturing a dual face package

METHOD OF MANUFACTURING WAFER LEVEL PACKAGE

Interposer and method for manufacturing the same

Method of manufacturing wafer level package

Dual face package and method of manufacturing the same