Seon-ho Choi

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Phoenix, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Microelectronic die including locking bump and method of making same
- Patent number 7,800,225
- Issue date Sep 21, 2010
- Intel Corporation
- Seon-ho Choi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Microelectronic Die Including Locking Bump and Method of Making Same
- Publication number 20080303143
- Publication date Dec 11, 2008
- Seon-ho Choi
- H01 - BASIC ELECTRIC ELEMENTS