Seon Jae Mun

Person

Busan, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Mutilayer electronic component and method of manufacturing the same
- Patent number 12,051,543
- Issue date Jul 30, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seon Jae Mun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayered electronic component
- Patent number 12,002,623
- Issue date Jun 4, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Tae Gyeom Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component and method of manufacturing the same
- Patent number 12,002,627
- Issue date Jun 4, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Tae Gyeom Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayered electronic component and method of manufacturing the same
- Patent number 12,002,628
- Issue date Jun 4, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Tae Gyeom Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component and method of manufacturing the same
- Patent number 11,996,244
- Issue date May 28, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seon Jae Mun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayered electronic component
- Patent number 11,990,284
- Issue date May 21, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jong Ho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic electronic component and method for manufacturin...
- Patent number 11,049,659
- Issue date Jun 29, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Kyoung Jin Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor and board having the same
- Patent number 10,770,227
- Issue date Sep 8, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Seon Jae Mun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a package substrate
- Patent number 8,835,302
- Issue date Sep 16, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Dong Gyu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for flip chip bonding and method of fabricating the same
- Patent number 8,671,564
- Issue date Mar 18, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Hueng Jae Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing substrate for flip chip and substrate for f...
- Patent number 8,486,760
- Issue date Jul 16, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Tae Joon Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package substrate capable of controlling the degree of warpage
- Patent number 8,456,003
- Issue date Jun 4, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Dong Gyu Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240379289
- Publication date Nov 14, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Seon Jae MUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYERED ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240274368
- Publication date Aug 15, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Tae Gyeom LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYERED ELECTRONIC COMPONENT
- Publication number 20230207192
- Publication date Jun 29, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Tae Gyeom LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230207209
- Publication date Jun 29, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Tae Gyeom LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYERED ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230207210
- Publication date Jun 29, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Tae Gyeom LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MUTILAYER ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220392703
- Publication date Dec 8, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Seon Jae MUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYERED ELECTRONIC COMPONENT
- Publication number 20220392706
- Publication date Dec 8, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Jong Ho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220384114
- Publication date Dec 1, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Seon Jae MUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURIN...
- Publication number 20200013553
- Publication date Jan 9, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Kyoung Jin CHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR AND BOARD HAVING THE SAME
- Publication number 20190157003
- Publication date May 23, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Seon Jae MUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR FLIP CHIP BONDING AND METHOD OF FABRICATING THE SAME
- Publication number 20140138821
- Publication date May 22, 2014
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hueng Jae OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MASK FOR BUMPING SOLDER BALLS ON CIRCUIT BOARD AND SOLDER BALL BUMP...
- Publication number 20140103098
- Publication date Apr 17, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Jin Won Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FABRICATING A PACKAGE SUBSTRATE
- Publication number 20130237049
- Publication date Sep 12, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Dong Gyu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130168144
- Publication date Jul 4, 2013
- Samsung Electro-mechanics Co., Ltd.
- Sung Won Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SQUEEGEE MODULE
- Publication number 20120047671
- Publication date Mar 1, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yeo Il Park
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Package substrate and method of fabricating the same
- Publication number 20110186991
- Publication date Aug 4, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Dong Gyu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package substrate and method of fabricating the same
- Publication number 20110133332
- Publication date Jun 9, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Seon Jae Mun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing substrate for flip chip and substrate for f...
- Publication number 20110079926
- Publication date Apr 7, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Tae Joon Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE FOR FLIP CHIP BONDING AND METHOD OF FABRICATING THE SAME
- Publication number 20100314161
- Publication date Dec 16, 2010
- Hueng Jae OH
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100271792
- Publication date Oct 28, 2010
- Samsung Electro-Mechanics CO., LTD.
- Jin-Won Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Substrate having metal post and method of manufacturing the same
- Publication number 20100132998
- Publication date Jun 3, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Dong Gyu Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board and method of manufacturing the same
- Publication number 20100044084
- Publication date Feb 25, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Dong Gyu LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Mask for screen printing and screen printing method using the same
- Publication number 20090025581
- Publication date Jan 29, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Soon Jin Cho
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Seon Jae Mun

Person

Patents Grantslast 30 patents

Mutilayer electronic component and method of manufacturing the same

Multilayered electronic component

Multilayer electronic component and method of manufacturing the same

Multilayered electronic component and method of manufacturing the same

Multilayer electronic component and method of manufacturing the same

Multilayered electronic component

Multilayer ceramic electronic component and method for manufacturin...

Capacitor and board having the same

Method of fabricating a package substrate

Substrate for flip chip bonding and method of fabricating the same

Method of manufacturing substrate for flip chip and substrate for f...

Package substrate capable of controlling the degree of warpage

Patents Applicationslast 30 patents

MULTILAYER ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

MULTILAYERED ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

MULTILAYERED ELECTRONIC COMPONENT

MULTILAYER ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

MULTILAYERED ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

MUTILAYER ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

MULTILAYERED ELECTRONIC COMPONENT

MULTILAYER ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURIN...

CAPACITOR AND BOARD HAVING THE SAME

SUBSTRATE FOR FLIP CHIP BONDING AND METHOD OF FABRICATING THE SAME

MASK FOR BUMPING SOLDER BALLS ON CIRCUIT BOARD AND SOLDER BALL BUMP...

METHOD OF FABRICATING A PACKAGE SUBSTRATE

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

SQUEEGEE MODULE

Package substrate and method of fabricating the same

Package substrate and method of fabricating the same

Method of manufacturing substrate for flip chip and substrate for f...

SUBSTRATE FOR FLIP CHIP BONDING AND METHOD OF FABRICATING THE SAME

ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME

Substrate having metal post and method of manufacturing the same

Printed circuit board and method of manufacturing the same

Mask for screen printing and screen printing method using the same