Seong Bo Shim

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Icheon, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming insulating layer on cond...
- Patent number 9,418,913
- Issue date Aug 16, 2016
- STATS ChipPAC Pte. Ltd.
- Seong Bo Shim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stackable integrated circuit package system
- Patent number 8,779,570
- Issue date Jul 15, 2014
- Stats Chippac Ltd.
- Seong Bo Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming insulating layer on cond...
- Patent number 8,349,721
- Issue date Jan 8, 2013
- STATS ChipPAC, Ltd.
- Seong Bo Shim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package in package system incorporating an internal stiffener compo...
- Patent number 8,288,205
- Issue date Oct 16, 2012
- Stats Chippac Ltd.
- Seong Bo Shim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Forming Insulating Layer on Cond...
- Publication number 20130075900
- Publication date Mar 28, 2013
- STATS ChipPAC, Ltd.
- Seong Bo Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Insulating Layer on Cond...
- Publication number 20110074026
- Publication date Mar 31, 2011
- STATS ChipPAC, Ltd.
- Seong Bo Shim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE IN PACKAGE SYSTEM INCORPORATING AN INTERNAL STIFFENER COMPO...
- Publication number 20090236719
- Publication date Sep 24, 2009
- Seong Bo Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE INTEGRATED CIRCUIT PACKAGE SYSTEM
- Publication number 20090236731
- Publication date Sep 24, 2009
- Seong Bo Shim
- H01 - BASIC ELECTRIC ELEMENTS