Seong Ho Shin

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Daegu, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package including a plurality of stacked chips
- Patent number 9,536,861
- Issue date Jan 3, 2017
- SK hynix Inc.
- Jae Woong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device packages having bumps and methods of manufacturin...
- Patent number 9,209,146
- Issue date Dec 8, 2015
- SK Hynix Inc.
- Seung Jee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device packages having bumps and methods of manufacturin...
- Patent number 8,907,487
- Issue date Dec 9, 2014
- SK Hynix Inc.
- Seung Jee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grooved coaxial-type transmission line, manufacturing method and pa...
- Patent number 7,400,222
- Issue date Jul 15, 2008
- Korea Advanced Institute of Science and Technology
- Young Se Kwon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF STACKED CHIPS
- Publication number 20160172331
- Publication date Jun 16, 2016
- SK HYNIX INC.
- Jae Woong YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGES HAVING BUMPS AND METHODS OF MANUFACTURIN...
- Publication number 20150056755
- Publication date Feb 26, 2015
- SK HYNIX INC.
- Seung Jee KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGES HAVING BUMPS AND METHODS OF MANUFACTURIN...
- Publication number 20130334683
- Publication date Dec 19, 2013
- SK HYNIX INC.
- Seung Jee KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Using Selectively Anodized Metal and Manufacturing Method T...
- Publication number 20070296075
- Publication date Dec 27, 2007
- Young-Se Kwon
- H01 - BASIC ELECTRIC ELEMENTS