Seong-Jae Heo

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Cheongju, KR

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Patents Grantslast 30 patents

Information Patent Grant
Encapsulation method for ball grid array semiconductor package
- Patent number 6,484,394
- Issue date Nov 26, 2002
- Hyundai Electronics Industries Co., Ltd.
- Seong-Jae Heo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Encapsulation method for ball grid array semiconductor package
- Publication number 20020148112
- Publication date Oct 17, 2002
- LG Semicon Co., Ltd.
- Seong-Jae Heo
- H01 - BASIC ELECTRIC ELEMENTS