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Seong Kwang Brandon KIM
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Singapore, SG
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Patents Grants
last 30 patents
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Patent Grant
Multi-chip ball grid array package and method of manufacture
Patent number
7,851,899
Issue date
Dec 14, 2010
UTAC - United Test and Assembly Test Center Ltd.
Fung Leng Chen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Cavity chip package
Patent number
7,339,278
Issue date
Mar 4, 2008
United Test & Assembly Center Ltd.
Henry Iksan
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
Multi-chip ball grid array package and method of manufacture
Publication number
20070158815
Publication date
Jul 12, 2007
Fung Leng Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CAVITY CHIP PACKAGE
Publication number
20070069371
Publication date
Mar 29, 2007
United Test & Assembly Center Ltd.
Henry IKSAN
H01 - BASIC ELECTRIC ELEMENTS