Seong-Wuk Na

Person

Seoul, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Bulk-acoustic resonator module
- Patent number 11,476,832
- Issue date Oct 18, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seung Wook Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Acoustic wave device and method of manufacturing the same
- Patent number 11,437,563
- Issue date Sep 6, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seung Wook Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bulk-acoustic wave resonator
- Patent number 11,277,113
- Issue date Mar 15, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seung Wook Park
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Acoustic wave device and method of manufacturing the same
- Patent number 11,177,789
- Issue date Nov 16, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seung Wook Park
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor package
- Patent number 11,171,096
- Issue date Nov 9, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seung Wook Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film type package
- Patent number 10,903,816
- Issue date Jan 26, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seung Wook Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Acoustic wave filter device and method of manufacturing the same
- Patent number 10,715,100
- Issue date Jul 14, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seong Hun Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 10,483,618
- Issue date Nov 19, 2019
- Samsung Electronics Co., Ltd.
- Seung Wook Park
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Acoustic wave filter device
- Patent number 10,432,170
- Issue date Oct 1, 2019
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae Hyun Jung
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Acoustic wave device and method of manufacturing the same
- Patent number 10,164,602
- Issue date Dec 25, 2018
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seung Wook Park
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method for controlling a power supply in an external terminal conne...
- Patent number 7,062,661
- Issue date Jun 13, 2006
- Samsung Electronics Co., Ltd.
- Seong-Wuk Na
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Map data base management method and system therefor
- Patent number 6,125,367
- Issue date Sep 26, 2000
- SamSung Electronics Co., Ltd.
- Seong Wuk NA
- G01 - MEASURING TESTING
Information Patent Grant
Method for processing name when combining numerical map shape data
- Patent number 6,005,961
- Issue date Dec 21, 1999
- SamSung Electronics Co., Ltd.
- Seong-Wuk Na
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
WAFER LEVEL PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240128136
- Publication date Apr 18, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Seung Wook PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACOUSTIC WAVE RESONATOR PACKAGE
- Publication number 20230179170
- Publication date Jun 8, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Seung Wook PARK
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
BULK-ACOUSTIC WAVE RESONATOR PACKAGE
- Publication number 20220200565
- Publication date Jun 23, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Tae Kyung LEE
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
BULK-ACOUSTIC WAVE RESONATOR
- Publication number 20210313954
- Publication date Oct 7, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Seung Wook PARK
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210035929
- Publication date Feb 4, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Seung Wook PARK
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
BULK-ACOUSTIC RESONATOR MODULE
- Publication number 20200177155
- Publication date Jun 4, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Seung Wook PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN-FILM TYPE PACKAGE
- Publication number 20200144986
- Publication date May 7, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Seung Wook PARK
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACOUSTIC WAVE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190140616
- Publication date May 9, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Seung Wook PARK
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20190131689
- Publication date May 2, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Seung Wook PARK
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ACOUSTIC WAVE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190019939
- Publication date Jan 17, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Seung Wook PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACOUSTIC WAVE FILTER DEVICE
- Publication number 20180159505
- Publication date Jun 7, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Jae Hyun JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACOUSTIC WAVE FILTER DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180159496
- Publication date Jun 7, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Seong Hun NA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACOUSTIC WAVE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20170077900
- Publication date Mar 16, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Seung Wook PARK
- H03 - BASIC ELECTRONIC CIRCUITRY

Seong-Wuk Na

Person

Patents Grantslast 30 patents

Bulk-acoustic resonator module

Acoustic wave device and method of manufacturing the same

Bulk-acoustic wave resonator

Acoustic wave device and method of manufacturing the same

Semiconductor package

Thin-film type package

Acoustic wave filter device and method of manufacturing the same

Semiconductor package and manufacturing method thereof

Acoustic wave filter device

Acoustic wave device and method of manufacturing the same

Method for controlling a power supply in an external terminal conne...

Map data base management method and system therefor

Method for processing name when combining numerical map shape data

Patents Applicationslast 30 patents

WAFER LEVEL PACKAGE AND METHOD OF MANUFACTURING THE SAME

ACOUSTIC WAVE RESONATOR PACKAGE

BULK-ACOUSTIC WAVE RESONATOR PACKAGE

BULK-ACOUSTIC WAVE RESONATOR

SEMICONDUCTOR PACKAGE

BULK-ACOUSTIC RESONATOR MODULE

THIN-FILM TYPE PACKAGE

ACOUSTIC WAVE DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

ACOUSTIC WAVE DEVICE AND METHOD OF MANUFACTURING THE SAME

ACOUSTIC WAVE FILTER DEVICE

ACOUSTIC WAVE FILTER DEVICE AND METHOD OF MANUFACTURING THE SAME

ACOUSTIC WAVE DEVICE AND METHOD OF MANUFACTURING THE SAME