SeongHun Mun

Person

Gyeonggi-do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Interposer substrate designs for semiconductor packages
- Patent number 9,905,491
- Issue date Feb 27, 2018
- STATS ChipPAC Pte. Ltd.
- In Sang Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with conductive pillars and met...
- Patent number 9,748,203
- Issue date Aug 29, 2017
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming conductive ink layer as...
- Patent number 9,331,007
- Issue date May 3, 2016
- STATS ChipPAC, Ltd.
- Insang Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of mitigating defects for semiconductor packages
- Patent number 9,184,067
- Issue date Nov 10, 2015
- Stats Chippac Ltd.
- KyungHwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with interposer shield and meth...
- Patent number 8,779,562
- Issue date Jul 15, 2014
- Stats Chippac Ltd.
- SeongMin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with encapsulation and method o...
- Patent number 8,643,181
- Issue date Feb 4, 2014
- Stats Chippac Ltd.
- JoHyun Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with stacking option and method...
- Patent number 8,378,476
- Issue date Feb 19, 2013
- Stats Chippac Ltd.
- SeongMin Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Forming Conductive Ink Layer as...
- Publication number 20140103509
- Publication date Apr 17, 2014
- STATS ChipPAC, Ltd.
- Insang Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONDUCTIVE PILLARS AND MET...
- Publication number 20130154092
- Publication date Jun 20, 2013
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER SHIELD AND METH...
- Publication number 20120241921
- Publication date Sep 27, 2012
- SeongMin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ENCAPSULATION AND METHOD O...
- Publication number 20110233751
- Publication date Sep 29, 2011
- JoHyun Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STACKING OPTION AND METHOD...
- Publication number 20110233747
- Publication date Sep 29, 2011
- SeongMin Lee
- H01 - BASIC ELECTRIC ELEMENTS

SeongHun Mun

Person

Patents Grantslast 30 patents

Interposer substrate designs for semiconductor packages

Integrated circuit packaging system with conductive pillars and met...

Semiconductor device and method of forming conductive ink layer as...

Methods of mitigating defects for semiconductor packages

Integrated circuit packaging system with interposer shield and meth...

Integrated circuit packaging system with encapsulation and method o...

Integrated circuit packaging system with stacking option and method...

Patents Applicationslast 30 patents

Semiconductor Device and Method of Forming Conductive Ink Layer as...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONDUCTIVE PILLARS AND MET...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER SHIELD AND METH...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ENCAPSULATION AND METHOD O...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STACKING OPTION AND METHOD...