Seongjun Kim

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Suita-Shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and bonding material for semiconductor device
- Patent number 9,217,192
- Issue date Dec 22, 2015
- Osaka University
- Katsuaki Suganuma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND BONDING MATERIAL FOR SEMICONDUCTOR DEVICE
- Publication number 20120319280
- Publication date Dec 20, 2012
- OSAKA UNIVERSITY
- Katsuaki Suganuma
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...