Seongmin Son

Person

Hwaseong-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating a semiconductor device
- Patent number 12,136,602
- Issue date Nov 5, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,887,841
- Issue date Jan 30, 2024
- Samsung Electronics Co., Ltd.
- Kyuha Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for improving bonding reliability
- Patent number 11,658,139
- Issue date May 23, 2023
- Samsung Electronics Co., Ltd.
- Jaehyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including interconnection structure including...
- Patent number 11,152,317
- Issue date Oct 19, 2021
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having through-electrodes and methods for fab...
- Patent number 9,847,276
- Issue date Dec 19, 2017
- Samsung Electronics Co., Ltd.
- Pil-Kyu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including through silicon via electrodes and...
- Patent number 9,153,559
- Issue date Oct 6, 2015
- Samsung Electronics Co., Ltd.
- Dosun Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240274593
- Publication date Aug 15, 2024
- Samsung Electronics Co., LTD
- Seongmin SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR DEVICE
- Publication number 20220068852
- Publication date Mar 3, 2022
- Samsung Electronics Co., Ltd.
- Ju-Il CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE FOR IMPROVING BONDING RELIABILITY
- Publication number 20220037273
- Publication date Feb 3, 2022
- Samsung Electronics Co., Ltd.
- Jaehyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20220013502
- Publication date Jan 13, 2022
- Samsung Electronics Co., Ltd.
- Kyuha Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20200098711
- Publication date Mar 26, 2020
- Samsung Electronics Co., Ltd.
- Ju-Il CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING THROUGH-ELECTRODES AND METHODS FOR FAB...
- Publication number 20150137326
- Publication date May 21, 2015
- Pil-Kyu KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING THROUGH SILICON VIA ELECTRODES AND...
- Publication number 20130127019
- Publication date May 23, 2013
- SAMSUNG ELECTRONICS CO., LTD.
- Dosun LEE
- H01 - BASIC ELECTRIC ELEMENTS

Seongmin Son

Person

Patents Grantslast 30 patents

Method of fabricating a semiconductor device

Semiconductor packages

Semiconductor package for improving bonding reliability

Semiconductor device including interconnection structure including...

Semiconductor devices having through-electrodes and methods for fab...

Semiconductor devices including through silicon via electrodes and...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

METHOD OF FABRICATING A SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE FOR IMPROVING BONDING RELIABILITY

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR DEVICES HAVING THROUGH-ELECTRODES AND METHODS FOR FAB...

SEMICONDUCTOR DEVICES INCLUDING THROUGH SILICON VIA ELECTRODES AND...