Seongyo KIM

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Asan-si, KR

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Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE COMPRISING DAM AND MULTI-LAYERED UNDER-FILL L...
- Publication number 20250070072
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Seongyo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE COMPRISING DUMMY STRUCTURE AT CORNER REGION T...
- Publication number 20250062210
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Seongyo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240186289
- Publication date Jun 6, 2024
- Samsung Electronics Co., Ltd.
- Hanmin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240162193
- Publication date May 16, 2024
- Samsung Electronics Co., Ltd.
- Seongyo KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING BUMPS WITH A PLURALITY OF SEPARATIO...
- Publication number 20240128221
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Minsoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230230946
- Publication date Jul 20, 2023
- Samsung Electronics Co., Ltd.
- Seongyo KIM
- H01 - BASIC ELECTRIC ELEMENTS